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LC75055PE-XXXX

Onsemi

LC75055PE-XXXX by Onsemi

LC75055PE-XXXX by Onsemi is a 100-terminal DSP with max supply voltage of 3.47V, clock frequency of 12.288MHz, and operating temp range from -40 to 85 °C. Ideal for industrial applications requiring low power consumption and high-speed digital signal processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,236 parts In-Stock

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Digiode

USA . 432 parts In-Stock

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432

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TANS Electronics

Latvia . 6,891 parts In-Stock

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6,891

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Kulean Microsystems

USA . 4,072 parts In-Stock

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Problanco Electronics

Mexico . 3,453 parts In-Stock

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SupplyDigital Components

Austria . 2,038 parts In-Stock

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Corphita

USA . 1,682 parts In-Stock

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UHIMA Technologies

Türkiye . 156 parts In-Stock

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Corohmni

South Africa . 101 parts In-Stock

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Overview

Unlock the power of innovative technology with the LC75055PE-XXXX from Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their products. The LC75055PE-XXXX falls under the category of Digital Signal Processors (DSPs), offering unmatched performance and versatility for a wide range of applications. This cutting-edge product boasts a sleek package design and low power mode, making it an ideal solution for industrial settings. Stay ahead of the competition and experience the value and benefits that Onsemi's LC75055PE-XXXX brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for portable and long-lasting applications.

Surface Mount: YES

Surface mount capabilities make installation and integration easier, saving time and effort during assembly.

Maximum Supply Voltage: 3.47 V

The high maximum supply voltage allows for versatility in power input options, accommodating a wide range of operating conditions.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient utilization of space and easy integration into electronic systems.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options and functionality for complex signal processing tasks.

Package Style (Meter): FLATPACK

The flatpack style offers a compact form factor, making it suitable for applications where space is a constraint.

Minimum Supply Voltage: 3.14 V

The low minimum supply voltage ensures efficient power consumption and operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended use.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes the product suitable for a wide range of environments.

Terminal Position: QUAD

Quad terminal positioning offers improved connectivity and organization for signal processing tasks requiring multiple inputs and outputs.

Maximum Seated Height: 3 mm

The low maximum seated height allows for easy integration into compact electronic devices and systems.

Width: 14 mm

The modest width of 14mm ensures that the product can fit into various electronic enclosures and setups without taking up too much space.

Maximum Clock Frequency: 12.288 MHz

A high maximum clock frequency enables rapid signal processing and real-time data handling for efficient performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and communication within the DSP, leading to improved processing speeds and efficiency.

Length: 20 mm

The length of 20mm strikes a balance between compactness and functionality, making the product versatile for various applications.

Temperature Grade: INDUSTRIAL

Being industrial-grade ensures the product's reliability and performance under demanding conditions, making it suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type signifies that the product is a digital signal processor, further confirming its suitability for signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making the product ideal for battery-powered or energy-efficient applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections, ensuring stable and uninterrupted signal processing.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V allows for stable and consistent power input, essential for reliable signal processing.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, the product offers precise connectivity and space-saving benefits for compact electronic designs.

Format: FIXED POINT

The fixed-point format simplifies signal processing tasks by providing a consistent framework for computations and data manipulation.

Low Power Mode: YES

The availability of a low power mode enhances energy efficiency, prolonging battery life and reducing overall power consumption.

Technical Specifications

Digital Signal Processors (DSPs) LC75055PE-XXXX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Onsemi

Specs

Barrel Shifter:

NO

Boundary Scan:

NO

Maximum Clock Frequency:

12.288 MHz

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G100

Length:

20 mm

Low Power Mode:

YES

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Seated Height:

3 mm

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.14 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LC75055PE-XXXX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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