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LC75055PE-6158-H

Onsemi

LC75055PE-6158-H by Onsemi

LC75055PE-6158-H by Onsemi is a 24-bit DSP with power supplies of 1.5V and 3.3V, operating b/w -40 to 85 °C. It has a flatpack style package with 100 terminals for industrial applications requiring digital signal processing in CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,472 parts In-Stock

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Digiode

USA . 1,400 parts In-Stock

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1,400

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Distributors (Availability)

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AZTECH Wire

Italy . 672 parts In-Stock

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$19.000

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672

$19.000

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$40.868

100+ parts

$37.190

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$33.512

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$40.868

$37.190

$33.512

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Component Stockers USA

USA . 586 parts In-Stock

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$99.990

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586

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TANS Electronics

Latvia . 6,367 parts In-Stock

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SupplyDigital Components

Austria . 5,925 parts In-Stock

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Kulean Microsystems

USA . 4,944 parts In-Stock

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Problanco Electronics

Mexico . 3,157 parts In-Stock

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Corphita

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 257 parts In-Stock

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Corohmni

South Africa . 195 parts In-Stock

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195

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Microchip USA

USA . 193 parts In-Stock

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Overview

Upgrade your digital signal processing capabilities with the LC75055PE-6158-H by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that are reliable and efficient. This DSP is perfect for a wide range of applications, offering unmatched performance and advanced features. Whether you're working on audio processing, telecommunications, or industrial automation, this product provides exceptional value, benefits, and advantages to help you achieve your goals. Trust Onsemi to elevate your projects to the next level with the LC75055PE-6158-H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on a circuit board, saving time and space in the overall design.

Package Shape: RECTANGULAR

The rectangular shape allows for a more compact and efficient layout on the circuit board, optimizing space usage.

Bit Size: 24

The 24-bit size provides higher precision and accuracy in processing digital signals, making it suitable for demanding applications.

Power Supplies (V): 1.5,3.3

The availability of multiple power supply options enables flexibility in integrating the product into various systems with different voltage requirements.

No. of Terminals: 100

Having a high number of terminals allows for more connectivity options and functions, making the product versatile and adaptable to different applications.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and efficient thermal management, making it suitable for space-constrained environments and industrial applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the product to withstand harsh environmental conditions and operate reliably in industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can also function in cold environments without compromising performance.

Terminal Position: QUAD

The quad terminal position provides stability and reliability in the connection, ensuring secure operation in demanding applications.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this temperature grade ensures the product can operate in rugged conditions and maintain performance consistency.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripherals, this product offers enhanced signal processing capabilities and versatility for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the product energy-efficient and suitable for real-time processing tasks.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and reliability in the connection, ensuring long-term performance and durability.

Maximum Supply Current: 173 mA

With a maximum supply current of 173 mA, the product operates efficiently and effectively without drawing excessive power from the power source.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for high-density mounting and precise connections, making the product suitable for compact designs and intricate configurations.

Format: FIXED POINT

The fixed-point format offers simplicity and efficiency in signal processing, making the product easier to implement and optimize for specific applications.

Technical Specifications

Digital Signal Processors (DSPs) LC75055PE-6158-H attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Onsemi

Specs

Bit Size:

24

Format:

FIXED POINT

JESD-30 Code:

R-PQFP-G100

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

173 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

LC75055PE-6158-H Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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