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LC749402BG-TLM-H

Onsemi

LC749402BG-TLM-H by Onsemi

LC749402BG-TLM-H by Onsemi is a 96-terminal IC with power supplies of 1.2V, 1.8/3.3V for industrial use in analog circuits. It features a grid array package style, operates b/w -40 to 85°C, and has a terminal pitch of 0.5mm for surface mount applications.

Median Price

$5.090

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$4.410

1k+ parts

$3.940

10k+ parts

$3.710

9,000

-

$4.410

$3.940

$3.710

DigiKey

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$5.090

1k+ parts

-

10k+ parts

-

9,000

-

$5.090

-

-

Verical

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$5.513

1k+ parts

$4.925

10k+ parts

-

9,000

-

$5.513

$4.925

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 600 parts In-Stock

1+ parts

$4.646

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$4.646

-

-

-

Vyrian

USA . 694 parts In-Stock

1+ parts

$4.890

100+ parts

-

1k+ parts

-

10k+ parts

-

694

$4.890

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 332 parts In-Stock

1+ parts

$4.401

100+ parts

-

1k+ parts

-

10k+ parts

-

332

$4.401

-

-

-

Corohmni

South Africa . 109 parts In-Stock

1+ parts

$4.890

100+ parts

-

1k+ parts

-

10k+ parts

-

109

$4.890

-

-

-

Continental Prestige Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.310

10k+ parts

-

9,000

-

-

$4.310

-

Problanco Electronics

Mexico . 6,816 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,816

-

-

-

-

Authorized Procurement Solutions

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,500

-

-

-

-

TANS Electronics

Latvia . 5,372 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,372

-

-

-

-

Kulean Microsystems

USA . 5,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,326

-

-

-

-

SupplyDigital Components

Austria . 3,749 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,749

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-

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UHIMA Technologies

Türkiye . 803 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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803

-

-

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Microchip USA

USA . 458 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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458

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-

-

Overview

Step into the future of technology with the LC749402BG-TLM-H by Onsemi! This innovative analog circuit IC offers top-notch quality and reliability, thanks to its industrial-grade construction. Perfect for a wide range of applications, this semiconductor provides power supplies ranging from 1.2V to 3.3V, making it versatile and efficient. With 96 terminals and a compact square package shape, this product is designed for seamless integration and performance. Experience the value and benefits that Onsemi brings to the table with this cutting-edge semiconductor solution. Elevate your projects with the LC749402BG-TLM-H today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and flexibility for various application environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board.

Power Supplies (V): 1.2,1.8/3.3

Provides multiple power supply options for different voltage requirements.

No. of Terminals: 96

High number of terminals allows for complex circuit connections and functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch provides high density and connectivity for advanced applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability in various operating conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance allows for use in extreme temperature environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Tin/Silver/Copper terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position is convenient for easy soldering and connection to the circuit board.

Other IC type: ANALOG CIRCUIT

Analog circuit type allows for precise and accurate signal processing and control.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections on the circuit board.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high density and compact design integration.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates the component can withstand prolonged exposure to moderate levels of moisture.

Technical Specifications

Other Function Semiconductors LC749402BG-TLM-H attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B96

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,10X10,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

LC749402BG-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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