Loading...

LC749403BG

Onsemi

LC749403BG by Onsemi

The Onsemi LC749403BG is a CMOS analog circuit IC with 144 terminals in a square grid array package. It operates b/w -40 °C to 85°C, suitable for industrial applications. With power supplies of 1.2V, 1.8V, and 3.3V, it is ideal for various electronic functions requiring fine pitch surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,120

-

-

-

-

Digiode

USA . 978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

978

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 8,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,169

-

-

-

-

SupplyDigital Components

Austria . 3,930 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,930

-

-

-

-

Kulean Microsystems

USA . 3,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,079

-

-

-

-

TANS Electronics

Latvia . 2,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,797

-

-

-

-

Corphita

USA . 1,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,987

-

-

-

-

Corohmni

South Africa . 473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

473

-

-

-

-

UHIMA Technologies

Türkiye . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Overview

Elevate your electronic designs with the LC749403BG by Onsemi, a cutting-edge solution for all your semiconductor needs. Manufactured by industry leader Onsemi, this versatile product offers unparalleled quality and reliability for a wide range of applications. Whether you're working on power supplies or analog circuits, this innovative component delivers exceptional performance and efficiency. Trust Onsemi for top-of-the-line technology and choose the LC749403BG for superior results in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components, ensuring reliability and durability.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and improving overall product design.

Package Shape: SQUARE

Square package shape makes it easier to handle, store, and install the component in a variety of applications.

Power Supplies (V): 1.2,1.8/3.3

Offers multiple power supply options, allowing flexibility in design and compatibility with different systems.

No. of Terminals: 144

High number of terminals provide connections for various signals and power sources, making it versatile for complex circuit applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style enable high-density mounting, allowing for more components to be placed in a smaller area.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the component can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliable operation even in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position facilitates efficient heat dissipation and easier soldering during assembly.

Other IC type: ANALOG CIRCUIT

Analog circuit type allows for precise signal processing and control, making it suitable for various analog applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable performance in demanding industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the component energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, reducing the risk of signal loss or disconnection.

Terminal Pitch: 0.8 mm

With a small terminal pitch, the component can accommodate more terminals in a compact space, improving overall system efficiency.

Technical Specifications

Other Function Semiconductors LC749403BG attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-PBGA-B144

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

LC749403BG Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 2