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LC749402PT-H

Onsemi

LC749402PT-H by Onsemi

LC749402PT-H by Onsemi is a 100-terminal flatpack IC with power supplies of 1.2V, 1.8/3.3V, suitable for industrial applications. It operates b/w -40 to 85 °C, featuring CMOS technology and Gull Wing terminals with a pitch of 0.5mm. This surface-mount square package is made of plastic/epoxy and has a moisture sensitivity level of 3.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,698 parts In-Stock

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Digiode

USA . 687 parts In-Stock

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AZTECH Wire

Italy . 646 parts In-Stock

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$22.230

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646

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QUARKTWIN TECHNOLOGY LTD

USA . 24,624 parts In-Stock

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Problanco Electronics

Mexico . 4,716 parts In-Stock

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Microchip USA

USA . 3,518 parts In-Stock

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Kulean Microsystems

USA . 2,345 parts In-Stock

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TANS Electronics

Latvia . 1,123 parts In-Stock

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SupplyDigital Components

Austria . 806 parts In-Stock

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UHIMA Technologies

Türkiye . 354 parts In-Stock

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Corphita

USA . 189 parts In-Stock

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Corohmni

South Africa . 146 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the LC749402PT-H by Onsemi. Manufactured with the highest quality standards, this cutting-edge product is a game-changer in the world of Other Function Semiconductors. With its versatile applications and innovative features, the LC749402PT-H offers unmatched value to customers seeking reliable and efficient solutions for their projects. Trust in Onsemi's reputation for excellence and experience the benefits of this exceptional semiconductor in your next design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good thermal and mechanical properties, making the product durable and reliable.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort.

Package Shape: SQUARE

Allows for efficient use of space on the PCB and makes it easier to align during assembly.

Power Supplies (V): 1.2,1.8/3.3

Provides a range of power supply options, suitable for various applications.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components.

Package Style (Meter): FLATPACK

Helps in efficient heat dissipation and saves space on the PCB.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Ensures the product can function in extreme cold temperatures as well.

Terminal Finish: TIN BISMUTH

Provides good corrosion resistance and solderability for reliable connections.

Terminal Position: QUAD

Helps in easy and accurate placement on the PCB.

Other IC type: ANALOG CIRCUIT

Enables the product to perform specific analog functions effectively.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Provides a strong mechanical connection and easy inspection during assembly.

Terminal Pitch: 0.5 mm

Offers high density interconnects, saving space on the PCB and allowing for miniaturization.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture, ensuring the product's reliability in various environments.

Technical Specifications

Other Function Semiconductors LC749402PT-H attributes and parameters. Explore more Other Function Semiconductors devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LC749402PT-H Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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