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LC74786

Onsemi

LC74786 by Onsemi

Onsemi's LC74786 is a Display Controller with 24 terminals, operating at -30 to 70 °C. It has a supply voltage of 5V and uses CMOS technology. Ideal for graphics processing applications due to its rectangular plastic package style and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,103 parts In-Stock

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Vyrian

USA . 620 parts In-Stock

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620

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TANS Electronics

Latvia . 7,110 parts In-Stock

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7,110

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Kulean Microsystems

USA . 6,551 parts In-Stock

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Problanco Electronics

Mexico . 5,972 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Corphita

USA . 983 parts In-Stock

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983

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UHIMA Technologies

Türkiye . 760 parts In-Stock

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760

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Corohmni

South Africa . 411 parts In-Stock

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SupplyDigital Components

Austria . 307 parts In-Stock

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Overview

Enhance the visual appeal of your electronic displays with the LC74786 by Onsemi. Crafted with precision and expertise, this display controller offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides seamless integration and exceptional performance. Elevate your designs with ease and confidence, as this innovative solution delivers value and benefits that will exceed your expectations. Trust Onsemi to bring your visuals to life with the LC74786.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and lightweight design, making the product easy to handle and install.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient and compact packaging of the display controller within devices, saving space.

Power Supplies (V): 5

Operating at 5V ensures compatibility with a wide range of devices and power sources, making integration easier.

No. of Terminals: 24

Having 24 terminals provides flexibility for connecting the display controller to various components in a system, enabling versatility.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line and shrink pitch package style allows for efficient assembly and installation, reducing manufacturing time and cost.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the display controller can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -30 °C

Being able to operate at temperatures as low as -30 °C ensures the display controller can function in cold environments without any issues.

Peripheral IC Type: GRAPHICS PROCESSOR

Featuring a graphics processor as the peripheral IC type provides enhanced graphics performance and capabilities for a better visual experience.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of devices, making the display controller efficient and reliable.

Terminal Form: THROUGH-HOLE

Having through-hole terminals simplifies the assembly process and improves the reliability of the connections, ensuring secure and stable operation.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures consistent performance and compatibility with various power sources, easing integration.

Terminal Pitch: 1.78 mm

A terminal pitch of 1.78mm provides a balance between compact design and ease of soldering, facilitating assembly and reducing the risk of errors.

Technical Specifications

Display Controllers LC74786 attributes and parameters. Explore more Display Controllers devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Display Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

LC74786 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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