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LB1273R

Onsemi

LB1273R by Onsemi

LB1273R by Onsemi is a 14-terminal peripheral driver with max output current of 0.23A, operating temp range -20 to 70 °C. Utilizes bipolar technology in rectangular package for commercial applications requiring dual terminal position and through-hole terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,585 parts In-Stock

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Vyrian

USA . 1,441 parts In-Stock

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1,441

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Distributors (Availability)

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SupplyDigital Components

Austria . 2,900 parts In-Stock

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2,900

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Kulean Microsystems

USA . 2,104 parts In-Stock

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TANS Electronics

Latvia . 1,711 parts In-Stock

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Problanco Electronics

Mexico . 1,621 parts In-Stock

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UHIMA Technologies

Türkiye . 597 parts In-Stock

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597

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Corohmni

South Africa . 331 parts In-Stock

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Corphita

USA . 207 parts In-Stock

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Overview

Enhance your electronics projects with the LB1273R by Onsemi, a high-quality peripheral driver that offers unmatched performance and reliability. Manufactured by industry leader Onsemi, this versatile component is perfect for a wide range of applications in the electronics industry. With its advanced technology and durable construction, the LB1273R ensures seamless operation in any environment. Trust Onsemi to deliver excellence in every product, providing you with the value and benefits you need to succeed. Upgrade your projects today with the LB1273R and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and protection for the peripheral driver, making it a reliable choice for long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various applications and compact design, providing versatility in installation.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and compatibility with a range of devices, making it suitable for diverse peripheral applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this peripheral driver can withstand high temperatures without compromising performance, ensuring reliability in various environments.

Maximum Output Current: 0.23 A

The maximum output current of 0.23A provides sufficient power for driving peripherals, making it suitable for a wide range of applications.

Technology: BIPOLAR

The bipolar technology used in this driver offers precision and accuracy in driving peripherals, ensuring optimal performance and efficiency.

Driver No. of Bits: 6

Having 6 bits allows for greater resolution and accuracy in data processing and control, making this peripheral driver suitable for complex applications that require high precision.

Technical Specifications

Peripheral Drivers LB1273R attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

6

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.23 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

LB1273R Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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