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LB1205M

Onsemi

LB1205M by Onsemi

LB1205M by Onsemi is a 16-terminal peripheral driver with built-in transient protection. It operates b/w -20 to 75 °C, with a supply voltage range of 3.5V to 7V. This small outline IC is ideal for buffer or inverter-based applications requiring sink output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,291 parts In-Stock

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Digiode

USA . 1,240 parts In-Stock

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1,240

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Distributors (Availability)

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Kulean Microsystems

USA . 7,159 parts In-Stock

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7,159

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SupplyDigital Components

Austria . 6,801 parts In-Stock

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Problanco Electronics

Mexico . 6,739 parts In-Stock

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6,739

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TANS Electronics

Latvia . 1,566 parts In-Stock

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Corphita

USA . 1,195 parts In-Stock

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1,195

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UHIMA Technologies

Türkiye . 360 parts In-Stock

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360

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Corohmni

South Africa . 145 parts In-Stock

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Overview

Discover the LB1205M by Onsemi, a top-of-the-line peripheral driver that offers unmatched quality and reliability. With a focus on innovation and cutting-edge technology, Onsemi ensures that their products meet the highest standards. This versatile device is perfect for a wide range of applications, providing customers with exceptional value and performance. Experience the advantages of the LB1205M and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the peripheral driver, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Surface mount capability allows for easy integration into electronic circuits, saving space and simplifying assembly processes.

Maximum Supply Voltage: 7 V

With a high maximum supply voltage, this peripheral driver can handle a wide range of input voltages, making it versatile for different applications.

No. of Functions: 4

Having multiple functions in one device reduces the need for multiple components, simplifying circuit design and reducing overall system complexity.

Built-in Protections: TRANSIENT

The transient protection feature helps safeguard the peripheral driver from voltage spikes and fluctuations, improving the reliability and longevity of the device.

No. of Terminals: 16

Having a high number of terminals allows for more connectivity options, enabling the peripheral driver to interact with a variety of other components and systems.

Minimum Operating Temperature: -20 °C

The wide minimum operating temperature range ensures the peripheral driver can function reliably in both cold and hot environments, increasing its overall usability.

Nominal Supply Voltage: 5 V

The common 5V supply voltage makes it compatible with many standard electronic systems, making it an easy choice for integration into existing setups.

Technical Specifications

Peripheral Drivers LB1205M attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

R-PDSO-G16

Length:

12.5 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-20 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

7 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width:

5.4 mm

Trade Compliance

LB1205M Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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