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LB1256M-E

Onsemi

LB1256M-E by Onsemi

LB1256M-E by Onsemi is a 20-terminal peripheral driver with max output current of 0.45A. Operating temp range: -25 to 70 °C, power supplies: 2/5V. Ideal for applications requiring bipolar technology and small outline package style in surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 802 parts In-Stock

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Digiode

USA . 306 parts In-Stock

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SupplyDigital Components

Austria . 5,185 parts In-Stock

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Kulean Microsystems

USA . 3,123 parts In-Stock

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TANS Electronics

Latvia . 798 parts In-Stock

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UHIMA Technologies

Türkiye . 756 parts In-Stock

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Problanco Electronics

Mexico . 650 parts In-Stock

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Corphita

USA . 621 parts In-Stock

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Corohmni

South Africa . 474 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the LB1256M-E by Onsemi. As a leader in the industry, Onsemi is known for delivering top-notch quality and reliability. The LB1256M-E falls under the Peripheral Drivers category, offering seamless integration and enhanced functionality. With its small outline package style and dual terminal position, this product is perfect for a wide range of applications. Experience the value and benefits of the LB1256M-E, providing customers with increased output current, precise technology, and easy installation. Elevate your projects with Onsemi's LB1256M-E and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for portable applications.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on circuit boards, saving space in the overall design.

Power Supplies (V): 2/5

The dual power supply options of 2V and 5V provide flexibility in voltage requirements, making it adaptable to various systems.

No. of Terminals: 20

The high number of terminals allows for multiple connections and configurations, enabling complex and versatile applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures stable performance even in harsh environments.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25 °C indicates reliability and functionality in cold conditions.

Maximum Output Current: 0.45 A

The high maximum output current of 0.45A enables driving of demanding loads with efficiency and precision.

Technology: BIPOLAR

The bipolar technology used in the product ensures accurate and controlled output signals, enhancing the overall performance.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections, reducing the risk of disconnection and enhancing durability.

Driver No. of Bits: 8

The 8-bit driver allows for precise control and manipulation of data, making it suitable for applications requiring high resolution.

Technical Specifications

Peripheral Drivers LB1256M-E attributes and parameters. Explore more Peripheral Drivers devices from Onsemi

Specs

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

.45 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LB1256M-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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