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LA1837M-TLM-E

Onsemi

LA1837M-TLM-E by Onsemi

LA1837M-TLM-E by Onsemi is a Silicon Tuner IC with 30 terminals, operating at -20 to 70°C. It features AM/FM demodulation, requires 9V power supply, and has a max supply current of 44mA. Ideal for audio tuner applications in commercial temperature grade environments.

Median Price

$1.130

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 23,991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.781

10k+ parts

-

23,991

-

-

$0.781

-

Rochester

USA . 19,994 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.010

10k+ parts

$0.903

19,994

-

$1.220

$1.010

$0.903

DigiKey

USA . 19,994 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.040

10k+ parts

-

19,994

-

-

$1.040

-

Verical

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.262

10k+ parts

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6,000

-

-

$1.262

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 157 parts In-Stock

1+ parts

$0.781

100+ parts

-

1k+ parts

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157

$0.781

-

-

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Digiode

USA . 2,336 parts In-Stock

1+ parts

$0.947

100+ parts

-

1k+ parts

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10k+ parts

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2,336

$0.947

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-

-

Bristol Electronics

USA . 977 parts In-Stock

1+ parts

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977

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Dan-Mar Components

USA . 977 parts In-Stock

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977

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 227 parts In-Stock

1+ parts

$0.781

100+ parts

-

1k+ parts

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10k+ parts

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227

$0.781

-

-

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Corphita

USA . 186 parts In-Stock

1+ parts

$0.897

100+ parts

-

1k+ parts

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186

$0.897

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$4.183

100+ parts

$3.807

1k+ parts

$3.430

10k+ parts

-

200

$4.183

$3.807

$3.430

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Continental Prestige Electronics

USA . 19,994 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.850

10k+ parts

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19,994

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-

$0.850

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TANS Electronics

Latvia . 5,407 parts In-Stock

1+ parts

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5,407

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Problanco Electronics

Mexico . 4,540 parts In-Stock

1+ parts

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4,540

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-

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Kulean Microsystems

USA . 3,474 parts In-Stock

1+ parts

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3,474

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SupplyDigital Components

Austria . 1,811 parts In-Stock

1+ parts

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1,811

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UHIMA Technologies

Türkiye . 671 parts In-Stock

1+ parts

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671

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Overview

Discover the ultimate audio experience with the LA1837M-TLM-E by Onsemi, a top-tier Silicon Tuner IC designed for exceptional performance and reliability. Crafted by the renowned manufacturer Onsemi, this product guarantees quality and precision in every application. Whether you're looking to enhance your audio tuner system or upgrade your entertainment devices, the LA1837M-TLM-E offers unparalleled value and benefits that will elevate your listening experience. Say goodbye to mediocre sound quality and hello to crystal-clear audio with this cutting-edge technology. Elevate your audio game today with the LA1837M-TLM-E by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

General IC Type: AUDIO TUNER

Specifically designed for audio tuner applications, ensuring optimal performance and compatibility with audio systems.

Power Supplies (V): 9

Operates on a standard 9V power supply, making it compatible with common power sources.

No. of Terminals: 30

A high number of terminals allows for versatile connectivity options and potential for advanced functionality.

Maximum Operating Temperature: 70 °C

Can operate efficiently at relatively high temperatures, suitable for various environmental conditions.

Demodulation Type: AM/FM

Supports both AM and FM demodulation, ensuring compatibility with a wide range of audio signals.

Technical Specifications

Silicon Tuner ICs LA1837M-TLM-E attributes and parameters. Explore more Silicon Tuner ICs devices from Onsemi

Specs

General IC Type:

Demodulation Type:

AM/FM

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP30,.4,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

44 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LA1837M-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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