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TEF6606T/V5,518

NXP Semiconductors

TEF6606T/V5,518 by NXP Semiconductors

NXP Semiconductors' TEF6606T/V5,518 is a Silicon Tuner IC with 32 terminals in a small outline package. It features AEC-Q100 screening and can withstand peak reflow temperatures up to 250°C. Ideal for audio tuner applications, this IC is surface mountable and has a moisture sensitivity level of 3.

Median Price

$4.126

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$4.126

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Vyrian

USA . 7,531 parts In-Stock

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Digiode

USA . 4,992 parts In-Stock

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Anansix

USA . 1,035 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 44 parts In-Stock

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$2.119

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44

$2.119

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Aztec Data Supply Inc.

USA . 4,605 parts In-Stock

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$2.790

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4,605

$2.790

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One Stop Electronics

USA . 186 parts In-Stock

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$2.800

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$2.800

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Semicontronic

India . 1,451 parts In-Stock

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$3.800

100+ parts

$3.705

1k+ parts

$3.686

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$3.800

$3.705

$3.686

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$3.831

100+ parts

$3.639

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$3.639

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200

$3.831

$3.639

$3.639

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Continental Prestige Electronics

USA . 4,994 parts In-Stock

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$4.126

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$4.043

4,994

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$4.043

Argo Parts USA

USA . 656 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$4.126

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$4.043

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$4.043

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Andel Nordic

Denmark . 1,432 parts In-Stock

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$4.137

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$3.972

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$3.972

1,432

$4.137

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$3.972

$3.972

Ampacity Inc.

Singapore . 1,627 parts In-Stock

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$10.800

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AZTECH Wire

Italy . 348 parts In-Stock

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$16.202

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348

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UNI Independent Distributors

Spain . 6,128 parts In-Stock

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Corphita

USA . 4,972 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$9.287

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$9.287

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$9.287

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$9.287

$9.287

$9.287

Perfect Parts

USA . 179 parts In-Stock

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Overview

Discover the unparalleled quality of the TEF6606T/V5,518 Silicon Tuner IC by NXP Semiconductors. This cutting-edge audio tuner offers exceptional performance and reliability in a compact package. Ideal for a variety of applications, this product provides unmatched value and benefits to customers seeking top-notch audio solutions. Trust NXP Semiconductors to deliver excellence in every aspect with the TEF6606T/V5,518.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy materials are commonly used in IC packages as they offer good protection and insulation for the internal components, ensuring durability and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and cost in the manufacturing process.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the IC meets automotive-grade quality and reliability standards, making it suitable for use in automotive applications where high performance and durability are required.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the circuit board, making it ideal for applications where board real estate is limited.

General IC Type: AUDIO TUNER

An audio tuner IC is specifically designed for audio applications, providing high-quality sound performance and tuning capabilities for audio devices.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options and integration with a wide range of circuits and components, increasing the product's compatibility and flexibility.

Package Style (Meter): SMALL OUTLINE

Small outline packages are space-saving and lightweight, making them ideal for portable or compact devices where size and weight considerations are important.

Terminal Position: DUAL

Dual terminal position provides added stability and reliability in connection, reducing the risk of signal loss or interference for improved overall performance.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, the IC can withstand high-temperature soldering processes, ensuring proper solder joint formation and secure attachment during assembly.

Terminal Form: GULL WING

Gull-wing terminals offer good solderability and mechanical strength, ensuring secure connections and reliability in various operating conditions.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the IC has moderate sensitivity to moisture, allowing for safe storage and handling under standard manufacturing conditions to prevent moisture-related damage.

Technical Specifications

Silicon Tuner ICs TEF6606T/V5,518 attributes and parameters. Explore more Silicon Tuner ICs devices from NXP Semiconductors

Specs

Additional Features:

OPERATES WITH SINGLE 8.5V SUPPLY

Built-in IF Amplifier (IF):

NO

General IC Type:

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Surface Mount:

YES

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

TEF6606T/V5,518 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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