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TEF6606T/V5,512

NXP Semiconductors

TEF6606T/V5,512 by NXP Semiconductors

AUDIO TUNER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,724 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,724

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Digiode

USA . 3,034 parts In-Stock

1+ parts

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1k+ parts

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3,034

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Anansix

USA . 206 parts In-Stock

1+ parts

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206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$2.418

100+ parts

$2.200

1k+ parts

$1.983

10k+ parts

-

5,000

$2.418

$2.200

$1.983

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AZTECH Wire

Italy . 291 parts In-Stock

1+ parts

$8.820

100+ parts

-

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291

$8.820

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One Stop Electronics

USA . 1,006 parts In-Stock

1+ parts

$10.800

100+ parts

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1,006

$10.800

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UNI Independent Distributors

Spain . 6,619 parts In-Stock

1+ parts

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6,619

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Corphita

USA . 1,710 parts In-Stock

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1,710

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Perfect Parts

USA . 1,075 parts In-Stock

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1,075

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Technical Specifications

Silicon Tuner ICs TEF6606T/V5,512 attributes and parameters. Explore more Silicon Tuner ICs devices from NXP Semiconductors

Specs

Additional Features:

OPERATES WITH SINGLE 8.5V SUPPLY

Built-in IF Amplifier (IF):

NO

General IC Type:

JESD-30 Code:

R-PDSO-G32

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Screening Level:

AEC-Q100

Surface Mount:

YES

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

TEF6606T/V5,512 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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