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LA1844M

Onsemi

LA1844M by Onsemi

LA1844M by Onsemi is a Silicon Tuner IC with built-in IF amplifier. It operates b/w -20 °C to 80°C, with supply voltage ranging from 4.3V to 8V. This audio tuner has 24 terminals and is commonly used in commercial extended temperature grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,146 parts In-Stock

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Vyrian

USA . 1,014 parts In-Stock

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SupplyDigital Components

Austria . 8,260 parts In-Stock

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Kulean Microsystems

USA . 6,162 parts In-Stock

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Problanco Electronics

Mexico . 3,268 parts In-Stock

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TANS Electronics

Latvia . 2,613 parts In-Stock

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Corphita

USA . 1,874 parts In-Stock

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Metaverse IC Inc.

Canada . 1,076 parts In-Stock

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UHIMA Technologies

Türkiye . 765 parts In-Stock

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Kepictronics

USA . 225 parts In-Stock

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Corohmni

South Africa . 191 parts In-Stock

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Overview

Experience the unparalleled quality and performance of the LA1844M Silicon Tuner IC by Onsemi. With a built-in IF amplifier and commercial extended temperature grade, this audio tuner offers exceptional value and benefits for a wide range of applications. From improving signal reception in consumer electronics to enhancing audio quality in automotive systems, this rectangular package with dual terminals provides reliability and efficiency. Trust Onsemi's reputation for innovation and excellence, and elevate your products with the LA1844M.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Built-in IF Amplifier (IF): YES

Having a built-in IF amplifier helps improve signal quality and reception, leading to better overall performance.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient and compact design, saving space in electronic devices.

General IC Type: AUDIO TUNER

Being an audio tuner specifically designed for this purpose ensures optimal performance and compatibility with audio systems.

No. of Terminals: 24

Having a high number of terminals allows for versatile connections and functionality in various setups.

Package Style (Meter): IN-LINE, SHRINK PITCH

This package style allows for easy integration into circuit boards and efficient signal transmission.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature ensures reliability even under demanding conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows for use in a wide range of environments, including cold temperatures.

Terminal Position: DUAL

Having dual terminal positions provides flexibility in mounting and connection options.

Maximum Seated Height: 3.9 mm

The low seated height allows for space-efficient installation in compact devices.

Width: 7.62 mm

The compact width contributes to the overall small footprint of the product, ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 4.3 V

The low minimum supply voltage ensures energy efficiency and compatibility with a wide range of power sources.

Nominal Noise Figure: 80 dB

The low nominal noise figure indicates high sensitivity and minimal interference during signal reception.

Length: 21 mm

The moderate length provides a good balance between compact design and functional spacing for terminals and components.

Temperature Grade: COMMERCIAL EXTENDED

Being rated as commercial extended ensures reliability and performance in typical operating environments.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for secure and reliable connections in various circuit board setups.

Terminal Pitch: 1.778 mm

The small terminal pitch enables high-density mounting and efficient signal routing within the package.

Maximum Supply Voltage (Vsup): 8 V

The high maximum supply voltage ensures compatibility with various power sources and reliable performance under different conditions.

Technical Specifications

Silicon Tuner ICs LA1844M attributes and parameters. Explore more Silicon Tuner ICs devices from Onsemi

Specs

Built-in IF Amplifier (IF):

YES

General IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

21 mm

Nominal Noise Figure:

80 dB

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Maximum Seated Height:

3.9 mm

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.3 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LA1844M General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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