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LA1844

Onsemi

LA1844 by Onsemi

LA1844 by Onsemi is a Silicon Tuner IC with built-in IF amplifier, suitable for audio tuner applications. It features a small outline package with 24 terminals and operates b/w -20 °C to 80°C. With a nominal noise figure of 80 dB, it requires a supply voltage ranging from 4.3V to 8V for optimal performance.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,720 parts In-Stock

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Vyrian

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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Kulean Microsystems

USA . 8,285 parts In-Stock

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TANS Electronics

Latvia . 3,573 parts In-Stock

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SupplyDigital Components

Austria . 3,414 parts In-Stock

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Problanco Electronics

Mexico . 1,916 parts In-Stock

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Corphita

USA . 1,728 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 730 parts In-Stock

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Corohmni

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Kepictronics

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Overview

Discover the cutting-edge LA1844 Silicon Tuner IC by Onsemi, a game-changer in audio tuner technology. With a built-in IF amplifier and compact design, this versatile IC is perfect for a wide range of applications. Onsemi's reputation for quality ensures top-notch performance and reliability. Experience superior sound quality and effortless integration with this innovative product. Upgrade your audio systems today with the LA1844 and enjoy unparalleled convenience and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product easy to handle and install.

Built-in IF Amplifier (IF): YES

Having a built-in IF amplifier eliminates the need for additional external components, simplifying the design and reducing cost.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB, optimizing the layout for better overall performance.

No. of Terminals: 24

Having a higher number of terminals provides more connectivity options and flexibility in system integration.

Maximum Operating Temperature: 80 °C

With a high maximum operating temperature, the product is suitable for a wide range of applications and environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Minimum Supply Voltage (Vsup): 4.3 V

The low minimum supply voltage allows for operation in low-power applications, increasing efficiency and reducing power consumption.

Nominal Noise Figure: 80 dB

A high nominal noise figure indicates good sensitivity and signal-to-noise ratio, resulting in clear audio reception.

Technical Specifications

Silicon Tuner ICs LA1844 attributes and parameters. Explore more Silicon Tuner ICs devices from Onsemi

Specs

Built-in IF Amplifier (IF):

YES

General IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

12.5 mm

Nominal Noise Figure:

80 dB

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Width:

5.4 mm

Trade Compliance

LA1844 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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