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LA1193M-MPB-E

Onsemi

LA1193M-MPB-E by Onsemi

LA1193M-MPB-E by Onsemi is a 20-terminal IC with demodulation type FM, suitable for industrial applications. It operates b/w -40 to 85 °C, drawing a max supply current of 29mA at 8V. The package style is small outline, making it ideal for surface mount designs.

Median Price

$0.480

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,385 parts In-Stock

1+ parts

-

100+ parts

$0.462

1k+ parts

$0.384

10k+ parts

$0.342

1,385

-

$0.462

$0.384

$0.342

DigiKey

USA . 1,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.580

10k+ parts

-

1,385

-

-

$0.580

-

Verical

USA . 1,385 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.480

10k+ parts

$0.428

1,385

-

-

$0.480

$0.428

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 601 parts In-Stock

1+ parts

$0.309

100+ parts

-

1k+ parts

-

10k+ parts

-

601

$0.309

-

-

-

Digiode

USA . 444 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

-

10k+ parts

-

444

$0.360

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 224 parts In-Stock

1+ parts

$0.309

100+ parts

-

1k+ parts

-

10k+ parts

-

224

$0.309

-

-

-

Corphita

USA . 1,957 parts In-Stock

1+ parts

$0.341

100+ parts

-

1k+ parts

-

10k+ parts

-

1,957

$0.341

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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27,626

-

-

-

-

Kepictronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,000

-

-

-

-

TANS Electronics

Latvia . 8,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,132

-

-

-

-

SupplyDigital Components

Austria . 6,882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,882

-

-

-

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Problanco Electronics

Mexico . 5,039 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,039

-

-

-

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Kulean Microsystems

USA . 2,044 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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2,044

-

-

-

-

Continental Prestige Electronics

USA . 1,385 parts In-Stock

1+ parts

-

100+ parts

$0.334

1k+ parts

-

10k+ parts

-

1,385

-

$0.334

-

-

UHIMA Technologies

Türkiye . 511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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511

-

-

-

-

Overview

Enhance your consumer electronics with the LA1193M-MPB-E by Onsemi, a premium quality IC that delivers superior performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a variety of applications in the consumer electronics category. With its innovative design and advanced technology, it offers customers exceptional value, benefits, and advantages. Upgrade your products today with the LA1193M-MPB-E and experience enhanced functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 20

Offers multiple connection points for various inputs and outputs, increasing functionality.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Technology: BIPOLAR

Provides reliable performance and accuracy in signal processing and communication.

Technical Specifications

Other Function Consumer ICs LA1193M-MPB-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

29 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LA1193M-MPB-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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