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LA1145M-TLM-E

Onsemi

LA1145M-TLM-E by Onsemi

LA1145M-TLM-E by Onsemi is a 20-terminal IC with demodulation type FM, operating at -20 to 70 °C. It has a power supply of 8V and max supply current of 40mA. Ideal for consumer electronics applications requiring bipolar technology and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 44,000 parts In-Stock

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Vyrian

USA . 7,568 parts In-Stock

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Digiode

USA . 2,179 parts In-Stock

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AZTECH Wire

Italy . 626 parts In-Stock

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$11.620

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Component Stockers USA

USA . 485 parts In-Stock

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$99.990

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S.R.D Solutions

India . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 7,172 parts In-Stock

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SupplyDigital Components

Austria . 4,190 parts In-Stock

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Kepictronics

USA . 3,495 parts In-Stock

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TANS Electronics

Latvia . 3,128 parts In-Stock

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Kulean Microsystems

USA . 2,939 parts In-Stock

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Corphita

USA . 2,419 parts In-Stock

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UHIMA Technologies

Türkiye . 253 parts In-Stock

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Corohmni

South Africa . 192 parts In-Stock

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Overview

Unlock the potential of your consumer electronics with the LA1145M-TLM-E by Onsemi. Designed with precision and expertise, this product offers unmatched quality and reliability. Perfect for a wide range of applications, this IC delivers superior performance and efficiency. With its advanced technology and innovative features, customers can expect seamless operation and enhanced functionality. Elevate your projects to new heights with the LA1145M-TLM-E and experience the value and benefits that Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packages are durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Power Supplies (V): 8

Operating at 8V provides a suitable power supply for the device to function efficiently.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, the product can withstand elevated temperatures without failure.

Demodulation Type: FM

Frequency Modulation (FM) demodulation allows for high-quality audio and data transmission, making the product ideal for communication applications.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise analog signals, ensuring reliable operation of the device.

Technical Specifications

Other Function Consumer ICs LA1145M-TLM-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

40 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

LA1145M-TLM-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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