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LA1140-E

Onsemi

LA1140-E by Onsemi

LA1140-E by Onsemi is a FM demodulation IC with 16 terminals and 8V power supply. It operates b/w -20 °C to 70°C, ideal for commercial applications. The package style is in-line with through-hole terminals, making it suitable for various consumer electronic functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,632 parts In-Stock

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Digiode

USA . 839 parts In-Stock

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AZTECH Wire

Italy . 161 parts In-Stock

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$14.990

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 6,808 parts In-Stock

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SupplyDigital Components

Austria . 5,662 parts In-Stock

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Problanco Electronics

Mexico . 4,844 parts In-Stock

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Corphita

USA . 2,322 parts In-Stock

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Kulean Microsystems

USA . 889 parts In-Stock

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UHIMA Technologies

Türkiye . 503 parts In-Stock

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Corohmni

South Africa . 152 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the LA1140-E from Onsemi. As a leading manufacturer in the industry, Onsemi sets the standard for quality and innovation. The LA1140-E falls under the category of Other Function Consumer ICs, making it versatile and ideal for a wide range of applications. With its superior design and cutting-edge technology, this product offers customers exceptional value, benefits, and advantages. Trust Onsemi's LA1140-E to deliver top-notch performance and meet all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the IC, making it suitable for long term use.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices, making it versatile in terms of design.

Power Supplies (V): 8

With a power supply of 8V, this IC can provide sufficient power for its intended functions.

No. of Terminals: 16

Having 16 terminals allows for multiple connection options, enhancing the flexibility of the IC in different circuits.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures the IC can function reliably even in elevated temperature conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C makes this IC suitable for use in cold environments without performance issues.

Terminal Finish: Tin/Bismuth (Sn/Bi)

The tin/bismuth terminal finish provides good solderability and corrosion resistance, ensuring a secure and long-lasting connection.

Demodulation Type: FM

The FM demodulation type allows for efficient signal processing, making this IC suitable for applications requiring accurate demodulation.

Maximum Supply Current: 30 mA

With a maximum supply current of 30 mA, this IC consumes low power, making it energy efficient.

Terminal Pitch: 1.5 mm

The 1.5 mm terminal pitch provides sufficient spacing for easy soldering and connection, ensuring proper functionality and reliability.

Technical Specifications

Other Function Consumer ICs LA1140-E attributes and parameters. Explore more Other Function Consumer ICs devices from Onsemi

Specs

Demodulation Type:

FM

JESD-30 Code:

R-PZIP-T16

JESD-609 Code:

e6

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP16,.12,59

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

8

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

30 mA

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

1.5 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

LA1140-E General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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