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JLC1562MNR2

Onsemi

JLC1562MNR2 by Onsemi

JLC1562MNR2 by Onsemi is a Parallel I/O Port IC with 8 I/O lines, operating at -40 to 85 °C. It features a max supply voltage of 6V and min of 4.2V, suitable for industrial applications requiring general-purpose parallel I/O functionality in a compact square chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 930 parts In-Stock

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930

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Digiode

USA . 727 parts In-Stock

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727

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 5,869 parts In-Stock

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5,869

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SupplyDigital Components

Austria . 5,682 parts In-Stock

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5,682

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TANS Electronics

Latvia . 4,375 parts In-Stock

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4,375

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Corphita

USA . 1,954 parts In-Stock

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1,954

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UHIMA Technologies

Türkiye . 513 parts In-Stock

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513

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Corohmni

South Africa . 372 parts In-Stock

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372

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Kulean Microsystems

USA . 163 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the JLC1562MNR2 by Onsemi, a top-quality parallel I/O port perfect for various applications. Onsemi's reputation for excellence in manufacturing guarantees reliability and durability. This versatile chip carrier offers customers the value of increased efficiency and functionality, with its compact design and wide operating temperature range. Upgrade your projects with the JLC1562MNR2 and experience seamless connectivity and enhanced performance like never before.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing overall production costs.

Maximum Supply Voltage: 6 V

Offers a higher maximum supply voltage, allowing for compatibility with a wide range of devices and systems.

Package Shape: SQUARE

Square package shape provides a compact form factor, ideal for space-constrained applications.

No. of Terminals: 16

With 16 terminals, this product offers ample connectivity options for various peripheral devices or components.

Minimum Supply Voltage: 4.2 V

With a relatively low minimum supply voltage, this product can operate efficiently even in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in extreme cold conditions without compromising functionality.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and ensures a secure connection during assembly.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Thin profile chip carrier package style saves space on the PCB and offers a sleek design for modern devices.

Width: 4 mm

Compact width makes this product suitable for applications where space-saving is essential.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time of 30 seconds minimizes thermal stress during assembly, ensuring product reliability.

Peak Reflow Temperature °C: 240

High peak reflow temperature allows for efficient soldering during assembly processes.

Length: 4 mm

Compact length complements the square package shape, offering a small footprint for integration into various devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability and durability in harsh operating conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel I/O port provides versatility for connecting and controlling various external devices or components.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and avoids potential health hazards associated with lead solder.

Terminal Pitch: 0.65 mm

Narrow terminal pitch of 0.65 mm allows for dense packing on the PCB, enabling efficient use of space.

No. of I/O Lines: 8

With 8 I/O lines, this product provides sufficient connectivity options for interfacing with external devices or peripherals.

Technical Specifications

Parallel I/O Ports JLC1562MNR2 attributes and parameters. Explore more Parallel I/O Ports devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

4 mm

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

JLC1562MNR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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