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JLC1562BNG

Onsemi

JLC1562BNG by Onsemi

JLC1562BNG by Onsemi is a Parallel I/O Port IC with 16 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 4.2V to 6V and is designed for industrial applications requiring general-purpose parallel I/O functionality in CMOS technology. The package style is an in-line rectangular shape measuring 19.175mm x 7.62mm with a seated height of 4.44mm, making it suitable for through-hole mounting.

Median Price

$1.014

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,231 parts In-Stock

1+ parts

-

100+ parts

$0.978

1k+ parts

$0.811

10k+ parts

$0.723

6,231

-

$0.978

$0.811

$0.723

DigiKey

USA . 6,231 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.220

10k+ parts

-

6,231

-

-

$1.220

-

Verical

USA . 2,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.014

10k+ parts

$0.904

2,025

-

-

$1.014

$0.904

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,532 parts In-Stock

1+ parts

$0.762

100+ parts

-

1k+ parts

-

10k+ parts

-

1,532

$0.762

-

-

-

Chip Stock

USA . 56,000 parts In-Stock

1+ parts

-

100+ parts

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56,000

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-

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Vyrian

USA . 4,500 parts In-Stock

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-

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4,500

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 56 parts In-Stock

1+ parts

$0.667

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$0.667

-

-

-

Corphita

USA . 1,818 parts In-Stock

1+ parts

$0.722

100+ parts

-

1k+ parts

-

10k+ parts

-

1,818

$0.722

-

-

-

AZTECH Wire

Italy . 414 parts In-Stock

1+ parts

$10.140

100+ parts

-

1k+ parts

-

10k+ parts

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414

$10.140

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 22,619 parts In-Stock

1+ parts

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22,619

-

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TANS Electronics

Latvia . 6,920 parts In-Stock

1+ parts

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6,920

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SupplyDigital Components

Austria . 6,459 parts In-Stock

1+ parts

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100+ parts

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6,459

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-

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Continental Prestige Electronics

USA . 6,231 parts In-Stock

1+ parts

-

100+ parts

$0.667

1k+ parts

-

10k+ parts

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6,231

-

$0.667

-

-

Problanco Electronics

Mexico . 4,245 parts In-Stock

1+ parts

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4,245

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Microchip USA

USA . 4,160 parts In-Stock

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4,160

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Kulean Microsystems

USA . 2,652 parts In-Stock

1+ parts

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100+ parts

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2,652

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UHIMA Technologies

Türkiye . 378 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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378

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Overview

Unlock the power of connectivity with the JLC1562BNG by Onsemi. Crafted with precision and expertise, this Parallel I/O Port offers seamless integration and reliable performance for a wide range of applications. From industrial automation to consumer electronics, this versatile device provides unparalleled value and convenience. Experience enhanced efficiency and productivity with the innovative technology of Onsemi. Choose quality, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Maximum Supply Voltage: 6 V

The high maximum supply voltage allows for flexibility in power sources without causing damage to the device.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient and space-saving PCB design.

No. of Terminals: 16

With a sufficient number of terminals, this product offers versatility in connecting to external devices.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this product suitable for use in extreme environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Parallel I/O Ports JLC1562BNG attributes and parameters. Explore more Parallel I/O Ports devices from Onsemi

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Peripheral IC Type:

Trade Compliance

JLC1562BNG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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