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JLC1562BFELG

Onsemi

JLC1562BFELG by Onsemi

JLC1562BFELG by Onsemi is a CMOS technology-based Parallel I/O Port with 8 I/O lines. It operates b/w -40 to 85 °C and has a supply voltage range of 4.2V to 6V, making it suitable for industrial applications requiring small outline packages with surface mount capabilities.

Median Price

$0.996

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 82,760 parts In-Stock

1+ parts

-

100+ parts

$0.977

1k+ parts

-

10k+ parts

-

82,760

-

$0.977

-

-

Rochester

USA . 82,645 parts In-Stock

1+ parts

-

100+ parts

$0.978

1k+ parts

$0.811

10k+ parts

$0.723

82,645

-

$0.978

$0.811

$0.723

DigiKey

USA . 82,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.220

10k+ parts

-

82,645

-

-

$1.220

-

Verical

USA . 80,885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.014

10k+ parts

$0.904

80,885

-

-

$1.014

$0.904

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,883 parts In-Stock

1+ parts

$0.762

100+ parts

-

1k+ parts

-

10k+ parts

-

1,883

$0.762

-

-

-

Vyrian

USA . 2,465 parts In-Stock

1+ parts

$0.802

100+ parts

-

1k+ parts

-

10k+ parts

-

2,465

$0.802

-

-

-

DigiKey Marketplace

USA . 82,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

82,760

-

-

-

-

Chip Stock

USA . 34,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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34,000

-

-

-

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PC Components Company LLC

USA . 1,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,987

-

-

-

-

Bristol Electronics

USA . 1,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,987

-

-

-

-

SPM Sales

USA . 1,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,240

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 187 parts In-Stock

1+ parts

$0.722

100+ parts

-

1k+ parts

-

10k+ parts

-

187

$0.722

-

-

-

Corohmni

South Africa . 283 parts In-Stock

1+ parts

$0.802

100+ parts

-

1k+ parts

-

10k+ parts

-

283

$0.802

-

-

-

Component Stockers USA

USA . 107,146 parts In-Stock

1+ parts

$0.830

100+ parts

$0.780

1k+ parts

$0.700

10k+ parts

$0.700

107,146

$0.830

$0.780

$0.700

$0.700

Continental Prestige Electronics

USA . 82,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.667

10k+ parts

-

82,760

-

-

$0.667

-

Kulean Microsystems

USA . 7,449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,449

-

-

-

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TANS Electronics

Latvia . 6,433 parts In-Stock

1+ parts

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100+ parts

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6,433

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-

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Problanco Electronics

Mexico . 5,496 parts In-Stock

1+ parts

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100+ parts

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5,496

-

-

-

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SupplyDigital Components

Austria . 3,482 parts In-Stock

1+ parts

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100+ parts

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3,482

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-

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Microchip USA

USA . 3,451 parts In-Stock

1+ parts

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100+ parts

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3,451

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Kepictronics

USA . 1,232 parts In-Stock

1+ parts

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100+ parts

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1,232

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UHIMA Technologies

Türkiye . 622 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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622

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-

Overview

Discover the innovative JLC1562BFELG by Onsemi, a high-quality Parallel I/O Port that offers unparalleled value and benefits to customers. Manufactured by the reputable Onsemi, this product is designed for a wide range of applications in industrial settings. With its advanced technology and reliable performance, this small outline package with dual terminals ensures seamless integration and optimal functionality. Experience the advantages of this versatile product, from its durable construction to its wide operating temperature range, making it the ideal choice for your project needs. Elevate your designs with the JLC1562BFELG and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to impact, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 6 V

The high maximum supply voltage of 6V provides flexibility in power supply options for the device.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to integrate into existing circuit designs.

No. of Terminals: 16

With 16 terminals, this product can support multiple connections and interfaces, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, allowing for more compact and efficient design layouts.

Minimum Supply Voltage: 4.2 V

The low minimum supply voltage of 4.2V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance even in challenging environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C enables operation in extreme cold conditions, ideal for industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for multiple connection options, accommodating different PCB layouts and configurations.

Maximum Seated Height: 2.05 mm

Low maximum seated height of 2.05mm minimizes space requirements and allows for compact device designs.

Width: 5.275 mm

Narrow width of 5.275mm saves space on the PCB and enables tight integration in electronic systems.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures reliable solder connections during manufacturing processes.

Length: 10.2 mm

Compact length of 10.2mm contributes to the overall small footprint of the device, suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the device can operate reliably in harsh industrial environments with wide temperature variations.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

General-purpose parallel IO port design provides flexibility for various input/output configurations and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the device energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminal form is suitable for surface mount applications, ensuring secure connections and ease of assembly.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V makes the device compatible with common power sources and existing electronic systems.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27mm allows for high-density mounting, ideal for applications requiring multiple connections in a limited space.

No. of I/O Lines: 8

With 8 I/O lines, this product offers sufficient input/output capabilities for a wide range of parallel communication tasks.

Technical Specifications

Parallel I/O Ports JLC1562BFELG attributes and parameters. Explore more Parallel I/O Ports devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

No. of I/O Lines:

8

No. of Ports:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Maximum Supply Voltage:

6 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Peripheral IC Type:

Trade Compliance

JLC1562BFELG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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