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FSDM0365RN

Onsemi

FSDM0365RN by Onsemi

FSDM0365RN by Onsemi is a switching regulator with max output current of 2.41A and max operating temp of 85°C. Ideal for applications requiring pulse width modulation control technique, such as power supplies and voltage converters. Package style is in-line with rectangular shape and plastic/epoxy material.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Chip Stock

USA . 38,000 parts In-Stock

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Digiode

USA . 3,264 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,850 parts In-Stock

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Nova Conductors

Japan . 870 parts In-Stock

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Vyrian

USA . 171 parts In-Stock

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Rebound Electronics

UK . 100 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Ampacity Inc.

Singapore . 853 parts In-Stock

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$0.500

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A-Z Elektronik GmbH

Germany . 15,489 parts In-Stock

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SupplyDigital Components

Austria . 6,174 parts In-Stock

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Kulean Microsystems

USA . 4,564 parts In-Stock

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Argo Parts USA

USA . 3,845 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,659 parts In-Stock

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Continental Prestige Electronics

USA . 3,349 parts In-Stock

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Problanco Electronics

Mexico . 3,277 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 1,173 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 847 parts In-Stock

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Kepictronics

USA . 650 parts In-Stock

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Microchip USA

USA . 385 parts In-Stock

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Corohmni

South Africa . 379 parts In-Stock

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UHIMA Technologies

Türkiye . 255 parts In-Stock

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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Glotronic Ltd.

UK . 40 parts In-Stock

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Assy Fe

Spain . 34 parts In-Stock

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Overview

Enhance your electronic devices with the high-quality FSDM0365RN by Onsemi, a leading manufacturer in the industry. This innovative switching regulator offers superior performance and reliability, making it ideal for a wide range of applications. From power supplies to LED lighting, this product delivers efficient control and precise output, ensuring optimal function and longevity. Upgrade your electronics with the FSDM0365RN and experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, making the product reliable and long-lasting.

Package Shape: RECTANGULAR

The rectangular shape helps in easy integration and compact placement within electronic devices.

Control Mode: CURRENT-MODE

Current-mode control allows for more stable and efficient regulation of output, enhancing performance.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures the product can withstand harsh environmental conditions.

Maximum Output Current: 2.41 A

With a high maximum output current, this product is suitable for applications requiring higher power requirements.

Technical Specifications

Switching Regulators & Controllers FSDM0365RN attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

9 V

Nominal Input Voltage:

14 V

JESD-30 Code:

R-PDIP-T8

Length:

9.415 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

2.41 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Maximum Switching Frequency:

73 kHz

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

FSDM0365RN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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