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FSDM0365RL

Onsemi

FSDM0365RL by Onsemi

FSDM0365RL by Onsemi is a switching regulator with max output current of 2.41A and max operating temp of 85 °C. Ideal for applications requiring pulse width modulation control technique, such as power supplies and voltage converters. Package style is small outline with gull wing terminals, suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,899 parts In-Stock

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Vyrian

USA . 2,324 parts In-Stock

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Native Components

USA . 609 parts In-Stock

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$19.304

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Northwest PG Solutions

USA . 1,680 parts In-Stock

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$19.111

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TANS Electronics

Latvia . 6,043 parts In-Stock

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Kulean Microsystems

USA . 5,880 parts In-Stock

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SupplyDigital Components

Austria . 2,942 parts In-Stock

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Corphita

USA . 2,435 parts In-Stock

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Problanco Electronics

Mexico . 1,677 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 767 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 190 parts In-Stock

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Overview

Discover the FSDM0365RL by Onsemi, a top-tier manufacturer in the Switching Regulators & Controllers category. This high-quality product offers customers unmatched reliability and efficiency in various applications. With its innovative design and cutting-edge technology, the FSDM0365RL provides exceptional value, benefits, and advantages to users looking for a superior performance solution. Experience seamless operation and enhanced functionality with this compact and versatile component that delivers exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that is suitable for a variety of environments, making the product versatile.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

Saves space on the PCB and allows for efficient placement within the design.

Maximum Operating Temperature: 85 °C

Ensures stability and reliability in a wide range of operating conditions.

Control Mode: CURRENT-MODE

Provides precise control over the output current, resulting in stable and efficient operation.

Width (mm): 6.4 mm

Compact size allows for flexibility in placement on the PCB, suitable for designs with limited space.

Nominal Input Voltage: 14 V

Compatible with a variety of power sources, making it versatile for different applications.

Maximum Switching Frequency: 73 kHz

High switching frequency allows for efficient power conversion and reduced output ripple.

Maximum Output Current: 2.41 A

Capable of delivering a relatively high output current, suitable for powering a variety of loads.

Technical Specifications

Switching Regulators & Controllers FSDM0365RL attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

9 V

Nominal Input Voltage:

14 V

JESD-30 Code:

R-PDSO-G8

Length:

9.2 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

2.41 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

3.7 mm

Surface Mount:

YES

Maximum Switching Frequency:

73 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

6.4 mm

Trade Compliance

FSDM0365RL Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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