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FSDM0365RNB

Onsemi

FSDM0365RNB by Onsemi

FSDM0365RNB by Onsemi is a switching regulator IC with 2.41A output current, 73kHz max switching frequency, and -25 to 85°C operating temp range. Ideal for power supply applications due to its current-mode control, pulse width modulation technique, and through-hole terminal form.

Median Price

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Lifecycle Status

EOL

Suppliers In-Stock

6

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1k+

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Chip Stock

USA . 53,500 parts In-Stock

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Digiode

USA . 3,287 parts In-Stock

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Rebound Electronics

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Vyrian

USA . 1,543 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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LWI Electronics Inc

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Andel Nordic

Denmark . 500 parts In-Stock

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$1.075

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$1.032

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$1.075

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$1.032

Ampacity Inc.

Singapore . 1,532 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 306 parts In-Stock

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Authorized Procurement Solutions

USA . 90,000 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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RC Electronics

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Kepictronics

USA . 56,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

USA . 16,556 parts In-Stock

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SupplyDigital Components

Austria . 6,238 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,210 parts In-Stock

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TANS Electronics

Latvia . 4,361 parts In-Stock

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Microchip USA

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Kulean Microsystems

USA . 3,580 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,473 parts In-Stock

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iodParts Technologies Inc.

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GreenTree Electronics

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Problanco Electronics

Mexico . 883 parts In-Stock

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Corphita

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South Africa . 205 parts In-Stock

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Overview

Experience the superior quality and reliability of Onsemi with the FSDM0365RNB, a cutting-edge switching regulator and controller that delivers unparalleled performance. Designed with precision and expertise, this innovative product offers customers the perfect balance of efficiency and versatility for a wide range of applications. Say goodbye to compromise with Onsemi's commitment to excellence, providing you with the value, benefits, and advantages you deserve in a high-quality electronic component. Elevate your projects to new heights with the FSDM0365RNB from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures a lightweight and durable construction, making it a reliable option for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and mounting in different circuit designs, providing flexibility in installation options.

No. of Terminals: 8

With 8 terminals, this product offers multiple connection points for efficient power management and distribution, making it suitable for complex electronic systems.

Package Style (Meter): IN-LINE

The in-line package style makes this regulator easy to integrate into existing systems or circuits, allowing for space-saving installation in tight spaces.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance under varying environmental conditions, making it suitable for industrial applications.

Control Mode: CURRENT-MODE

The current-mode control provides precise regulation of output voltage, allowing for stable and efficient power conversion in different load conditions.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25°C ensures the regulator can function in cold environments without compromising performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin terminal finish offers excellent solderability and electrical conductivity, ensuring secure connections for stable operation in electronic circuits.

Terminal Position: DUAL

The dual terminal position provides redundancy in connections, enhancing reliability and stability in power distribution systems.

Maximum Seated Height: 5.08 mm

The compact maximum seated height allows for low-profile and space-efficient installation, making it ideal for applications with limited space constraints.

Width (mm): 7.62 mm

The narrow width of 7.62 mm enables easy placement on PCBs with dense component layouts, offering versatility in circuit design and board space optimization.

Other IC type: SWITCHING REGULATOR

Being a switching regulator, this product offers high efficiency and low power dissipation, making it an energy-efficient choice for various electronic devices.

Length: 9.415 mm

The moderate length of 9.415 mm provides a balance between compact size and ease of handling, making it suitable for a wide range of applications.

Maximum Switching Frequency: 73 kHz

The high maximum switching frequency of 73 kHz allows for fast response times and efficient power delivery, making it ideal for applications requiring dynamic load changes.

Maximum Supply Current (Isup): 5 mA

With a maximum supply current of 5 mA, this regulator ensures minimal power consumption during operation, contributing to energy efficiency in electronic systems.

Maximum Output Current: 2.41 A

The high maximum output current of 2.41 A enables the regulator to handle power requirements for a variety of loads, making it a versatile solution for different applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers secure mounting and soldering connections, ensuring mechanical stability and reliability in the overall system.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique provides precise regulation of output voltage levels, allowing for efficient power conversion and minimal ripple in the output signal.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm enables compatibility with common PCB layouts and connectors, facilitating easy integration into existing electronic systems.

Technical Specifications

Switching Regulators & Controllers FSDM0365RNB attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.415 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

2.41 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Maximum Supply Current (Isup):

5 mA

Surface Mount:

NO

Maximum Switching Frequency:

73 kHz

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

FSDM0365RNB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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