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FSA3357K8X

Onsemi

FSA3357K8X by Onsemi

FSA3357K8X by Onsemi is a CMOS single-ended multiplexer with 8 terminals, operating at industrial temperature grade. It features a max on-state resistance of 30 ohm, switching voltage of 5.5V, and nominal off-state isolation of 58 dB. Ideal for applications requiring fast switching times and low on-state resistance in compact designs.

Median Price

$0.154

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 11,008 parts In-Stock

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$0.320

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$0.168

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$0.141

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Flip Electronics (Authorized)

USA . 39,000 parts In-Stock

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EBV Elektronik

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Verical

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$0.143

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Rochester

USA . 3,000 parts In-Stock

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$0.154

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$0.128

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$0.114

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Distributors (In-Stock)

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Greenchips

USA . 2,656 parts In-Stock

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$0.111

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$0.091

Ozdisan Elektronik

Türkiye . 1,157 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Digiode

USA . 1,347 parts In-Stock

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Component Electronics Inc.

Canada . 2,800 parts In-Stock

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Vyrian

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Chip Stock

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NAC Semi

USA . 6,000 parts In-Stock

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Rebound Electronics

UK . 4,242 parts In-Stock

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Legend Electronics Inc.

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Speed Components Ltd

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A&K Electronics

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Rotakorn

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Bristol Electronics

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Netsource Technology, Inc.

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Prism Electronics

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EMSNET

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Holdelec - ElecDif-Pro

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Semi Source

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Florida Circuit

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Corohmni

South Africa . 54 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Argo Parts USA

USA . 4,465 parts In-Stock

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$0.559

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Ampacity Inc.

Singapore . 15,078 parts In-Stock

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Semicontronic

India . 14,718 parts In-Stock

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Corphita

USA . 2,199 parts In-Stock

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Continental Prestige Electronics

USA . 2,926 parts In-Stock

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Microchip USA

USA . 219 parts In-Stock

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Aztec Data Supply Inc.

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Perfect Parts

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Kepictronics

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Lixinc

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Infinite Electronics LLP (Excess)

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Kulean Microsystems

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TANS Electronics

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Supply Digital

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GreenTree Electronics

Israel . 727 parts In-Stock

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UHIMA Technologies

Türkiye . 484 parts In-Stock

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Problanco Electronics

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iodParts Technologies Inc.

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Assy Fe

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Overview

Elevate your electronic designs with the FSA3357K8X by Onsemi, a premium multiplexer and switch that offers exceptional quality and reliability. This versatile component is perfect for a wide range of applications, from industrial automation to consumer electronics. Experience seamless switching capabilities and superior performance with this innovative product, designed to meet the highest industry standards. Trust in Onsemi's expertise and take advantage of the value and benefits that the FSA3357K8X brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and reliability to the product, making it suitable for various environments.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, especially for compact spaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding conditions without sacrificing performance.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, leading to efficient operation and reliable performance.

Nominal On-state Resistance Match: 0.31 ohm

Having a low nominal on-state resistance match promotes accurate signal transmission and minimizes signal loss, making this product a reliable choice for critical applications.

Technical Specifications

Multiplexers & Switches FSA3357K8X attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Nominal Off-state Isolation:

58 dB

Nominal On-state Resistance Match:

.31 ohm

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

7.2 ns

Maximum Switch-on Time:

15 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

FSA3357K8X Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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