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FS6131-01I

Onsemi

FS6131-01I by Onsemi

FS6131-01I by Onsemi is a Clock Generator with 16 terminals, operating at 230 MHz max output frequency. It has a supply voltage range of 4.5V to 5.5V and temperature range from -40 °C to 85°C. Ideal for industrial applications requiring precise clock generation in compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,371 parts In-Stock

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Digiode

USA . 953 parts In-Stock

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953

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Distributors (Availability)

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Native Components

USA . 478 parts In-Stock

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$0.340

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$0.326

478

$0.340

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$0.326

Northwest PG Solutions

USA . 715 parts In-Stock

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$0.374

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$0.330

715

$0.374

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$0.330

Kulean Microsystems

USA . 7,613 parts In-Stock

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7,613

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SupplyDigital Components

Austria . 5,047 parts In-Stock

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5,047

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TANS Electronics

Latvia . 4,485 parts In-Stock

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4,485

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Problanco Electronics

Mexico . 2,973 parts In-Stock

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2,973

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Corphita

USA . 1,305 parts In-Stock

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UHIMA Technologies

Türkiye . 914 parts In-Stock

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Corohmni

South Africa . 303 parts In-Stock

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Overview

Upgrade your electronic devices with the FS6131-01I clock generator by Onsemi, a leading manufacturer known for superior quality and reliability. Ideal for a wide range of applications, this clock generator offers precise timing and synchronization without compromising performance. With its compact design and advanced technology, this product ensures seamless operation at industrial-grade temperatures. Experience the value and benefits of Onsemi's FS6131-01I and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this clock generator can operate reliably in various power supply conditions, ensuring stability in performance.

Package Shape: RECTANGULAR

The rectangular package shape maximizes space efficiency on the PCB, allowing for more components to be placed in a compact design.

Maximum Output Clock Frequency: 230 MHz

The high maximum output clock frequency of 230 MHz enables this clock generator to support fast data processing and high-performance applications.

No. of Terminals: 16

Having 16 terminals provides ample connection options for interfacing with other components in the system, enhancing versatility and compatibility.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this clock generator can withstand harsh environmental conditions, making it suitable for industrial applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this clock generator energy-efficient and reliable in noisy environments.

Technical Specifications

Clock Generators FS6131-01I attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.89 mm

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

230 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Primary Clock/Crystal Frequency:

28 MHz

Maximum Seated Height:

1.73 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

FS6131-01I Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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