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FS6127-01

Onsemi

FS6127-01 by Onsemi

FS6127-01 by Onsemi is a clock generator with max output frequency of 27 MHz. It operates in temp range 0-70 °C, suitable for commercial applications. With small outline package style and 8 terminals, it's ideal for surface mount designs requiring clock generation up to 5.25 V supply voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 376 parts In-Stock

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Vyrian

USA . 219 parts In-Stock

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Native Components

USA . 880 parts In-Stock

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$0.736

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880

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Northwest PG Solutions

USA . 675 parts In-Stock

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$0.809

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675

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Problanco Electronics

Mexico . 6,149 parts In-Stock

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Kulean Microsystems

USA . 6,073 parts In-Stock

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SupplyDigital Components

Austria . 5,044 parts In-Stock

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TANS Electronics

Latvia . 2,471 parts In-Stock

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UHIMA Technologies

Türkiye . 797 parts In-Stock

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Corphita

USA . 215 parts In-Stock

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Corohmni

South Africa . 96 parts In-Stock

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Overview

Elevate your electronic devices with the FS6127-01 Clock Generator by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their products. Clock generators are essential components for various applications such as telecommunications, consumer electronics, and industrial equipment. The FS6127-01 offers precise clock frequency outputs up to 27 MHz, ensuring optimal performance for your devices. Trust Onsemi to provide you with the value, benefits, and advantages you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.25 V

A high maximum supply voltage tolerance ensures reliable operation and protection against voltage spikes.

Maximum Output Clock Frequency: 27 MHz

The high maximum output clock frequency enables the generation of fast and precise timing signals for various applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows the clock generator to function reliably in a wide range of environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Clock Generators FS6127-01 attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

27 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Primary Clock/Crystal Frequency:

13.5 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

FS6127-01 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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