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FS6128-04G-XTP

Onsemi

FS6128-04G-XTP by Onsemi

FS6128-04G-XTP by Onsemi is a clock generator with 27MHz output frequency, suitable for commercial applications. It operates b/w 0-70 °C, with supply voltage of 3V to 3.6V. This small outline package IC has 8 terminals and uses CMOS technology for efficient performance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,595 parts In-Stock

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Digiode

USA . 1,272 parts In-Stock

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AZTECH Wire

Italy . 1,109 parts In-Stock

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$15.890

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$17.419

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$15.851

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$14.284

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Corohmni

South Africa . 124 parts In-Stock

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$53.836

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Problanco Electronics

Mexico . 7,832 parts In-Stock

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Kepictronics

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SupplyDigital Components

Austria . 7,203 parts In-Stock

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TANS Electronics

Latvia . 5,999 parts In-Stock

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Authorized Procurement Solutions

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Kulean Microsystems

USA . 1,025 parts In-Stock

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Northwest PG Solutions

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Corphita

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UHIMA Technologies

Türkiye . 576 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic designs with the FS6128-04G-XTP clock generator by Onsemi! Crafted with precision and expertise, this small outline package clock generator offers a maximum output clock frequency of 27 MHz, making it ideal for a wide range of applications. With a commercial-grade temperature grade and a nominal supply voltage of 3.3V, this clock generator ensures reliable performance and accuracy. Trust Onsemi for quality and innovation that exceeds expectations. Elevate your projects with the FS6128-04G-XTP and experience unparalleled value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the clock generator.

Surface Mount: YES

Being surface mountable makes installation and soldering easier and more convenient, especially for compact electronic devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in powering the clock generator and ensures compatibility with various systems.

Maximum Output Clock Frequency: 27 MHz

The high maximum output clock frequency enables this clock generator to support high-speed operations and tasks efficiently.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this clock generator is suitable for use in standard commercial environments.

Technology: CMOS

The CMOS technology used in this clock generator offers low power consumption and high noise immunity for reliable performance.

Technical Specifications

Clock Generators FS6128-04G-XTP attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.89 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

27 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

18 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.73 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

FS6128-04G-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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