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FS6128-07

Onsemi

FS6128-07 by Onsemi

FS6128-07 by Onsemi is a clock generator with max output freq of 27 MHz. It operates b/w 0-70 °C, suitable for commercial applications. With small outline package style and 8 terminals, it's ideal for surface mount designs requiring clock generation.

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Digiode

USA . 276 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 200 parts In-Stock

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Vyrian

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Native Components

USA . 790 parts In-Stock

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Northwest PG Solutions

USA . 997 parts In-Stock

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SupplyDigital Components

Austria . 4,895 parts In-Stock

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Problanco Electronics

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Emar International I/E

Canada . 3,000 parts In-Stock

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Assy Fe

Spain . 2,985 parts In-Stock

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TANS Electronics

Latvia . 1,458 parts In-Stock

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Kulean Microsystems

USA . 1,200 parts In-Stock

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UHIMA Technologies

Türkiye . 529 parts In-Stock

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Corphita

USA . 506 parts In-Stock

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Perfect Parts

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Corohmni

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your electronics with the FS6128-07 clock generator by Onsemi - a top-tier manufacturer known for quality and innovation. This versatile component is a game-changer in clock generators, offering precise timing solutions for a wide range of applications. With a maximum output clock frequency of 27 MHz and a small outline package style, this product delivers exceptional performance and efficiency. Trust Onsemi to provide reliable, cutting-edge technology that brings value and benefits to your projects. Experience the advantages of the FS6128-07 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock generator.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving space.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs for versatile use in different applications.

Package Shape: RECTANGULAR

Simplifies the design and integration of the clock generator into electronic devices.

Maximum Output Clock Frequency: 27 MHz

Provides a high frequency output for precision timing in electronic systems.

No. of Terminals: 8

Offers flexibility in connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

Enables compact and space-saving designs for electronic devices.

Minimum Supply Voltage: 3 V

Ensures reliable operation even with lower voltage inputs.

Maximum Operating Temperature: 70 °C

Provides a wide operating temperature range for use in various environments.

Minimum Operating Temperature: 0 °C

Ensures the clock generator can function in low-temperature conditions without issues.

Terminal Position: DUAL

Allows for multiple connection options for enhanced compatibility with different systems.

Maximum Seated Height: 1.75 mm

Provides a low profile design for the clock generator, making it suitable for slim devices.

Width: 3.9 mm

Compact width dimension for easy integration into tight spaces on circuit boards.

Length: 4.9 mm

Small length size for efficient use of PCB real estate.

Temperature Grade: COMMERCIAL

Designed for standard commercial operating temperature ranges.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Specifically designed for clock generation functions, ensuring reliable timing signals.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high performance.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering onto PCBs for secure and stable connections.

Nominal Supply Voltage: 3.3 V

Optimal voltage setting for efficient and stable operation of the clock generator.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with widely used PCB layouts.

Nominal Primary Clock/Crystal Frequency: 18 MHz

Offers a reliable clock frequency for synchronization in electronic systems.

Technical Specifications

Clock Generators FS6128-07 attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

27 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Nominal Primary Clock/Crystal Frequency:

18 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

FS6128-07 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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