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FQT7N10

Onsemi

FQT7N10 by Onsemi

FQT7N10 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a 6.8A Max Pulsed Drain Current and 0.35 ohm Max DS On Resistance. This SMALL OUTLINE transistor operates b/w -55 to 150 °C and has an EAS of 50 mJ.

Median Price

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Austria . 7,723 parts In-Stock

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Kulean Microsystems

USA . 5,801 parts In-Stock

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TANS Electronics

Latvia . 2,910 parts In-Stock

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Problanco Electronics

Mexico . 1,067 parts In-Stock

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Native Components

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Türkiye . 362 parts In-Stock

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Overview

The FQT7N10 by Onsemi is a top-of-the-line Power Field Effect Transistor (FET) designed for switching applications. With a minimum DS Breakdown Voltage of 100V and a Maximum Drain-Source On Resistance of 0.35 ohm, this N-CHANNEL transistor offers superior performance and reliability. Its SINGLE configuration with BUILT-IN DIODE makes it easy to use, while its SMALL OUTLINE package ensures space-saving convenience. Trust in Onsemi's expertise in semiconductor technology and elevate your projects with the FQT7N10 for efficient power management and enhanced functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient electron flow in the desired direction, enhancing the overall performance of the transistor.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode within the transistor, saving space and reducing component count.

Transistor Application: SWITCHING

Ideal for applications requiring fast switching speeds and high efficiency, making it suitable for a variety of electronic devices.

Minimum DS Breakdown Voltage: 100 V

Provides a high breakdown voltage, ensuring reliable operation in high voltage applications.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and enabling automated assembly processes.

Maximum Drain Current (ID): 1.7 A

Capable of handling a moderate current, suitable for a range of power applications without overheating.

Maximum Power Dissipation (Abs): 2 W

Can dissipate heat effectively, preventing overheating and ensuring stable operation under varying load conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and fast operation, making it a reliable choice for power switching applications.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures without performance degradation, ensuring reliability in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) FQT7N10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

50 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

1.7 A

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.35 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

13 pF

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Maximum Pulsed Drain Current (IDM):

6.8 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

85 ns

Maximum Turn On Time (ton):

85 ns

Trade Compliance

FQT7N10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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