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FQA46N15

Onsemi

FQA46N15 by Onsemi

FQA46N15 by Onsemi is a N-CHANNEL Power FET with 150V DS Breakdown Voltage, ideal for SWITCHING applications. It features 200A IDM, 650mJ EAS, and 0.042 ohm RDS(on). The transistor operates in ENHANCEMENT MODE with a max power dissipation of 250W at 175°C.

Median Price

$2.805

Lifecycle Status

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18

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1k+

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Arrow

USA . 338 parts In-Stock

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$2.017

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$1.847

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$1.636

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Chip1Stop

Japan . 61 parts In-Stock

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$2.290

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Mouser Electronics

USA . 1,560 parts In-Stock

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$2.450

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$1.960

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Farnell

UK . 794 parts In-Stock

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$3.190

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$1.890

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$1.620

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Element14

Singapore . 794 parts In-Stock

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$6.030

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$3.170

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Rochester

USA . 260 parts In-Stock

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$2.530

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Verical

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Digiode

USA . 486 parts In-Stock

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$1.664

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Vyrian

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Voyager Components

USA . 9 parts In-Stock

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$3.000

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9

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$3.000

American Microsemiconductor Inc.

USA . 13 parts In-Stock

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$5.900

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Flip Electronics

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Dan-Mar Components

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Prism Electronics

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Zilex Electronics Inc.

Canada . 15 parts In-Stock

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Inventory MP

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Corphita

USA . 1,153 parts In-Stock

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$1.577

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Corohmni

South Africa . 296 parts In-Stock

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$1.750

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Northwest PG Solutions

USA . 2,311 parts In-Stock

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$3.091

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Continental Prestige Electronics

USA . 2,410 parts In-Stock

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$3.130

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$1.960

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$1.830

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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Kulean Microsystems

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A-Z Elektronik GmbH

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SupplyDigital Components

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Microchip USA

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 3,280 parts In-Stock

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Supply Digital

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TANS Electronics

Latvia . 1,875 parts In-Stock

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Alle Elektronik GmbH

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Native Components

USA . 845 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 467 parts In-Stock

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Kepictronics

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Glotronic Ltd.

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Assy Fe

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Overview

Enhance your power switching applications with the high-quality FQA46N15 Power Field Effect Transistor from Onsemi. This N-channel transistor offers a maximum pulsed drain current of 200A and a minimum DS breakdown voltage of 150V, making it ideal for a wide range of switching tasks. With a package body material of plastic/epoxy and a rugged flange mount style, this transistor is built to last. Trust in the reliability and performance of Onsemi products and experience the value and benefits that the FQA46N15 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

Allows for better control and efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode within the transistor package.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in those scenarios.

Minimum DS Breakdown Voltage: 150 V

Provides a high level of voltage tolerance, making the product suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 200 A

Handles high current pulses effectively, making it suitable for demanding transient conditions.

Maximum Power Dissipation (Abs): 250 W

Capable of dissipating high levels of power without overheating, ensuring stability in operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and reliability in the operation of the transistor.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without degradation, suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FQA46N15 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

FAST SWITCHING

Avalanche Energy Rating (EAS):

650 mJ

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA46N15 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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