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FODM8801AR2

Onsemi

FODM8801AR2 by Onsemi

FODM8801AR2 by Onsemi is a single optocoupler with max forward current of 0.02A, ideal for applications requiring high isolation voltage up to 3750V. It features a min CTR of 35%, operating temperature range from -40°C to 125°C, and surface mounting feature.

Median Price

$1.260

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Adafruit Industries

USA . 200 parts In-Stock

1+ parts

$0.471

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$0.447

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$0.447

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200

$0.471

$0.447

$0.447

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Chip1Stop

Japan . 225 parts In-Stock

1+ parts

$0.898

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$0.626

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$0.592

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$0.898

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$0.592

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Mouser Electronics

USA . 8,894 parts In-Stock

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$1.610

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$0.868

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$0.748

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$0.640

8,894

$1.610

$0.868

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$0.640

Newark

USA . 2,661 parts In-Stock

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$1.660

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$0.994

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$1.660

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DigiKey

USA . 329 parts In-Stock

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$1.680

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$0.903

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$0.733

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$0.644

329

$1.680

$0.903

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$0.644

Farnell

UK . 4,568 parts In-Stock

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$1.931

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$0.830

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$0.633

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$0.598

4,568

$1.931

$0.830

$0.633

$0.598

Arrow

USA . 337,500 parts In-Stock

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$0.553

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Verical

USA . 337,500 parts In-Stock

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Element14

Singapore . 2,661 parts In-Stock

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$1.260

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$1.150

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Avnet

USA . 2,500 parts In-Stock

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Digiode

USA . 2,166 parts In-Stock

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$0.447

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Nova Conductors

Japan . 550 parts In-Stock

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$1.724

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Vyrian

USA . 87,671 parts In-Stock

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Chip Stock

USA . 42,060 parts In-Stock

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HZD GmbH

Germany . 7,000 parts In-Stock

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NAC Semi

USA . 2,500 parts In-Stock

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$0.936

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Flip Electronics

USA . 1,563 parts In-Stock

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Bristol Electronics

USA . 383 parts In-Stock

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$0.647

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$0.483

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383

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$0.647

$0.483

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 105,812 parts In-Stock

1+ parts

$0.400

100+ parts

$0.390

1k+ parts

$0.388

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105,812

$0.400

$0.390

$0.388

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Ampacity Inc.

Singapore . 97,195 parts In-Stock

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$0.400

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Corphita

USA . 3,105 parts In-Stock

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$0.424

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$0.471

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$0.447

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$0.447

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Corohmni

South Africa . 287 parts In-Stock

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Aztec Data Supply Inc.

USA . 187 parts In-Stock

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$0.582

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Argo Parts USA

USA . 4,800 parts In-Stock

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$0.652

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$0.633

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$0.633

Continental Prestige Electronics

USA . 1,030 parts In-Stock

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$0.652

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$0.639

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$0.652

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Netroflash

USA . 1,000 parts In-Stock

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$1.724

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Glotronic Ltd.

UK . 160,000 parts In-Stock

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Eastek

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Lixinc

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Perfect Parts

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Kepictronics

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Kulean Microsystems

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TANS Electronics

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

Austria . 4,159 parts In-Stock

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Futuretech Components

Singapore . 2,700 parts In-Stock

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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Supply Digital

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Problanco Electronics

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UHIMA Technologies

Türkiye . 816 parts In-Stock

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Authorized Procurement Solutions

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Robosynatics

Brazil . 20 parts In-Stock

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Lucentia Tech

USA . 20 parts In-Stock

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Overview

Upgrade your electronic designs with the FODM8801AR2 optocoupler transistor output from Onsemi. Known for their high-quality components, Onsemi delivers reliable and efficient products that meet industry standards. This single configuration optocoupler offers a wide range of applications, providing customers with peace of mind in their projects. With a minimum current transfer ratio of 35% and maximum isolation voltage of 3750V, this product ensures optimal performance and safety. Trust Onsemi to deliver superior solutions for all your optocoupler needs.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to use and less prone to wiring errors.

Maximum Forward Current: 0.02 A

Can handle a maximum forward current of 0.02 A, suitable for various applications.

Optoelectronic Type: TRANSISTOR OUTPUT OPTOCOUPLER

Transistor output optocoupler provides efficient isolation between input and output signals.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without risking damage.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperature environments as well.

Terminal Finish: NICKEL PALLADIUM GOLD

Gives the terminals corrosion resistance and good conductivity.

Maximum Power Dissipation: 0.15 W

Low power dissipation ensures efficient energy usage.

Minimum Current Transfer Ratio: 35 %

A higher current transfer ratio ensures accurate signal transfer.

Maximum Dark Current: 100 nA

Low dark current minimizes signal distortion in the off state.

Maximum Response Time: 0.00002 s

Fast response time ensures quick signal transmission.

Minimum Collector-emitter Breakdown Voltage: 75 V

Collector-emitter breakdown voltage of 75 V provides protection against voltage spikes.

Nominal Current Transfer Ratio: 138 %

High nominal current transfer ratio ensures accurate signal amplification.

Maximum Isolation Voltage: 3750 V

High isolation voltage ensures complete electrical separation between input and output.

Mounting Feature: SURFACE MOUNT

Surface mount allows for easy installation on PCBs.

Maximum Forward Voltage: 1.8 V

Low forward voltage drop minimizes power loss.

Maximum On State Current: 0.03 A

Capable of handling a maximum on-state current of 0.03 A.

Technical Specifications

Optocoupler Transistor Outputs FODM8801AR2 attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED

Minimum Collector-emitter Breakdown Voltage:

75 V

Configuration:

SINGLE

Minimum Current Transfer Ratio:

35 %

Nominal Current Transfer Ratio:

138 %

Maximum Dark Current:

100 nA

Maximum Forward Current:

.02 A

Maximum Forward Voltage:

1.8 V

Maximum Isolation Voltage:

3750 V

JESD-609 Code:

e4

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.03 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.15 W

Maximum Response Time:

.00002 s

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

Trade Compliance

FODM8801AR2 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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