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FODM453V

Onsemi

FODM453V by Onsemi

The Onsemi FODM453V is a single optocoupler with a max forward current of 0.025A and isolation voltage of 3750V, ideal for logic IC output applications. Operating b/w -40°C to 85°C, it offers a data rate of 1MBps and min CTR of 15%, making it suitable for surface mount installations with a matte tin finish.

Median Price

$2.340

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,000 parts In-Stock

1+ parts

$2.340

100+ parts

$1.297

1k+ parts

$1.069

10k+ parts

$0.960

3,000

$2.340

$1.297

$1.069

$0.960

Mouser Electronics

USA . 2,984 parts In-Stock

1+ parts

$2.340

100+ parts

$1.300

1k+ parts

$0.997

10k+ parts

$0.958

2,984

$2.340

$1.300

$0.997

$0.958

Distributors (In-Stock)

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Digiode

USA . 2,707 parts In-Stock

1+ parts

$2.232

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2,707

$2.232

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Sensible Micro Corp

USA . 6,685 parts In-Stock

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6,685

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Vyrian

USA . 2,528 parts In-Stock

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2,528

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ComSIT Distribution GmbH

Germany . 1,003 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 2,966 parts In-Stock

1+ parts

$2.000

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2,966

$2.000

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Corphita

USA . 881 parts In-Stock

1+ parts

$2.115

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881

$2.115

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Component Stockers USA

USA . 3,824 parts In-Stock

1+ parts

$2.290

100+ parts

$1.180

1k+ parts

$0.910

10k+ parts

-

3,824

$2.290

$1.180

$0.910

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Corohmni

South Africa . 312 parts In-Stock

1+ parts

$2.350

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312

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iodParts Technologies Inc.

India . 184,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,527 parts In-Stock

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Perfect Parts

USA . 6,452 parts In-Stock

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SupplyDigital Components

Austria . 4,164 parts In-Stock

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Problanco Electronics

Mexico . 3,832 parts In-Stock

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Argo Parts USA

USA . 1,561 parts In-Stock

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Kulean Microsystems

USA . 1,440 parts In-Stock

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Supply Digital

USA . 930 parts In-Stock

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930

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TANS Electronics

Latvia . 860 parts In-Stock

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Continental Prestige Electronics

USA . 635 parts In-Stock

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UHIMA Technologies

Türkiye . 544 parts In-Stock

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544

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Enhance the performance of your electronic devices with the FODM453V by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. The FODM453V falls under the category of Optocoupler Circuit Outputs, offering a single configuration with a maximum forward current of 0.025 A. With a wide range of applications including logic IC output optocoupler, this product provides exceptional value and benefits to customers. Upgrade your electronics with the FODM453V and experience the advantages of superior performance and precise functionality.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to use and integrate into various circuit designs.

Maximum Forward Current: 0.025 A

Can handle high current levels without getting damaged, ensuring reliability.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

Specifically designed for logic IC outputs, providing accurate signal transmission.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without performance degradation, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate at low temperatures, making it versatile for use in different environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and enhances the durability of the product.

Maximum Power Dissipation: 0.1 W

Can handle power dissipation efficiently, preventing overheating.

Minimum Current Transfer Ratio: 15 %

Provides a reliable transfer of current, ensuring accurate signal transmission.

Maximum Isolation Voltage: 3750 V

High isolation voltage ensures safety and prevents interference between circuits.

Nominal Data Rate: 1 MBps

High data rate allows for fast and efficient communication between devices.

Mounting Feature: SURFACE MOUNT

Surface mount design makes it easy to mount on PCBs, saving space and reducing assembly time.

Maximum Forward Voltage: 1.8 V

Low forward voltage ensures energy efficiency and minimal power loss.

Maximum On State Current: 0.008 A

Can handle high current levels when in the on state, ensuring stable operation.

Technical Specifications

Optocoupler Circuit Outputs FODM453V attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

CMOS COMPATIBLE, UL RECOGNIZED, VDE APPROVED

Configuration:

SINGLE

Minimum Current Transfer Ratio:

15 %

Nominal Data Rate:

1 MBps

Maximum Forward Current:

.025 A

Maximum Forward Voltage:

1.8 V

Maximum Isolation Voltage:

3750 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum On State Current:

.008 A

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.1 W

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

Trade Compliance

FODM453V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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