Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi FODM453R2 is a single optocoupler with a max forward current of 0.025A and logic IC output type. It operates b/w -40 to 85°C, has an isolation voltage of 3750V, and data rate of 1MBps. Ideal for surface mount applications requiring high isolation and low power dissipation.
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Single configuration makes it easy to use and integrate into circuit designs.
High maximum forward current allows for reliable operation within specified limits.
Logic IC output optocoupler provides accurate and efficient signal transmission.
High maximum operating temperature ensures stable performance in various environments.
Low minimum operating temperature allows for operation in cold conditions.
Matte tin finish offers good electrical conductivity and corrosion resistance.
High maximum power dissipation capacity ensures efficient energy handling.
Minimum current transfer ratio determines efficiency and accuracy of signal transmission.
High maximum isolation voltage provides excellent protection against electrical hazards.
Fast nominal data rate ensures quick signal transmission and response times.
Surface mount design facilitates easy and secure installation on circuit boards.
Low maximum forward voltage helps in reducing power consumption and heat generation.
Low maximum on-state current ensures efficient operation and minimal power loss.
Optocoupler Circuit Outputs FODM453R2 attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi
Additional Features:
Configuration:
Minimum Current Transfer Ratio:
Nominal Data Rate:
Maximum Forward Current:
Maximum Forward Voltage:
Maximum Isolation Voltage:
JESD-609 Code:
Mounting Feature:
No. of Elements:
No. of Functions:
Maximum On State Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optoelectronic Type:
Maximum Power Dissipation:
Sub-Category:
Terminal Finish:
FODM453R2 Optoelectronics trade compliance attributes, and parameters.
HTS
8541.40.80.00
SB
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148WS
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Grande Electronics
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
BAV99
Siemens
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
Central Semiconductor
SN6505BDBVR
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
INA826AIDGKR
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
6N139-X009
LOGIC IC OUTPUT OPTOCOUPLER; Additional Features: CMOS COMPATIBLE, UL RECOGNIZED; Configuration: SINGLE; Maximum Isolation Voltage: 2500 V; Maximum On State Current: .06 A; Maximum Operating Temperature: 100 Cel;
TLP2770(TP,E(O
Toshiba
Toshiba's TLP2770(TP,E(O optocoupler features 5000V isolation voltage, 20MBps data rate, and -40 to 125°C operating temperature range. Ideal for logic IC output applications requiring fast response time of 1.3ns in a surface mount configuration.
HCPL0701
Onsemi
The Onsemi HCPL0701 is a single optocoupler with logic IC output. It features a max forward current of 0.02A, min CTR of 400%, and isolation voltage of 2500V. Ideal for surface mount applications in temperature-sensitive environments like industrial automation and power management systems.
SFH6747T
Vishay Intertechnology
Vishay Intertechnology's SFH6747T is a single optocoupler with a max forward current of 0.02A and isolation voltage of 3000V. Ideal for logic IC output applications, it operates b/w -40°C to 100°C temperature range and has a matte tin terminal finish for surface mount installation.
6N139-L
Lite-on Technology
6N139-L by Lite-on Technology is a single optocoupler with max forward current of 0.02A and isolation voltage of 5000V. Ideal for logic IC output applications, it operates b/w -40°C to 85°C with response time as fast as 60μs.
FOD8320R2V
FOD8320R2V by Onsemi is a Logic IC Output Optocoupler with 0.025A max forward current, 5000V isolation voltage, and 1.8V max forward voltage. Ideal for applications requiring high-speed response time and surface mounting feature in temperature range of -40 to 100°C.
TLP700F
LOGIC IC OUTPUT OPTOCOUPLER; No. of Elements: 1; Maximum Operating Temperature: 100 Cel; Maximum Isolation Voltage: 5000 V; No. of Functions: 1; Minimum Operating Temperature: -40 Cel;
FOD8342
The Onsemi FOD8342 is a single optocoupler with a max forward current of 0.025A and an isolation voltage of 5000V. It is ideal for logic IC output applications, operating b/w -40°C to 100°C temperature range. The rectangular-shaped device has matte tin terminal finish and surface mounting feature.
H11L1
Isocom Components
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: TIN; Maximum Power Dissipation: .25 W; No. of Elements: 1; Configuration: SINGLE;
TLP2361(TPL,E
Toshiba's TLP2361(TPL,E is a single optocoupler with max. forward current of 0.01A, ideal for logic IC output applications. It operates b/w -40 to 125°C, offers 3750V isolation voltage, and has a response time of 3ns. Suitable for surface mounting with a data rate of 15MBps.
TLP2710(TP,E(T
Toshiba's TLP2710(TP,E(T) optocoupler features a max isolation voltage of 5000V, 11ns response time, and 5MBps data rate. Ideal for logic IC output applications, it operates b/w -40 to 125°C with a min supply voltage of 2.7V.
TLP2766A(E
Toshiba TLP2766A(E is a single optocoupler with 0.025A forward current, ideal for logic IC outputs. It operates b/w -40 to 125°C, offers 5000V isolation voltage, and has a response time of 5ns. Suitable for surface mount applications with a data rate of 20MBps.
HCPL-2630-020E
Broadcom
Broadcom's HCPL-2630-020E is a 2-channel optocoupler with separate configuration. It features a max forward current of 0.015A, logic IC output, and 100ns response time. Ideal for applications requiring high isolation voltage up to 5000V, such as industrial control systems and power supplies.
HCNW3120#300
Hewlett Packard
HCNW3120#300 by Hewlett Packard is a COMPLEX optocoupler with 0.025A forward current, 5000V isolation voltage, and logic IC output. Ideal for applications requiring high voltage protection and signal transmission in environments ranging from -40°C to 100°C.
HCPL-3700-500E
Agilent Technologies
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Configuration: COMPLEX; Minimum Supply Voltage: 2 V; Nominal Supply Voltage: 18 V; Maximum Power Dissipation: .21 W;
6N136
Sharp Corporation
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Nominal Response Time: 30 ns; Additional Features: UL RECOGNIZED; Configuration: SINGLE; Maximum On State Current: .008 A;
Aborn Electronics
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Configuration: SINGLE; Shape: RECTANGULAR; No. of Elements: 1; Nominal Response Time: 30 ns;
HCPL-0211-500E
Optocoupler - IC Outputs; Mounting Feature: SURFACE MOUNT; No. of Elements: 1; Maximum Operating Temperature: 85 Cel; Nominal Supply Voltage: 20 V; Maximum Isolation Voltage: 3750 V;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); No. of Functions: 1; JESD-609 Code: e0; Shape: RECTANGULAR;
TLP250(F)
Toshiba TLP250(F) is a complex optocoupler with max. forward current of 0.02A and max. isolation voltage of 2500V. Ideal for logic IC output applications, it operates b/w -20°C to 85°C temperature range, offering a max on-state current of 1.5A.
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FODM8071R2
The Onsemi FODM8071R2 is a single optocoupler with a max forward current of 0.02A and isolation voltage of 3750V. With logic IC output, it operates b/w -40 to 110°C, ideal for high-speed data transmission at 20MBps in surface mount applications.
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Matte Tin (Sn); JESD-609 Code: e3; Nominal Data Rate: 20 MBps; Maximum Operating Temperature: 110 Cel; Minimum Supply Voltage: 3 V;
FODM8071
The Onsemi FODM8071 is a single optocoupler with a max forward current of 0.02 A and an isolation voltage of 3750 V. With a nominal data rate of 20 MBps, it is ideal for logic IC output applications. Operating b/w -40 to 110 °C, this surface mount device has a fast response time of 55 ns.
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Matte Tin (Sn); Additional Features: CMOS COMPATIBLE, UL RECOGNIZED; Configuration: SINGLE; JESD-609 Code: e3; Maximum On State Current: .01 A;
FODM452R2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel; No. of Elements: 1; Configuration: SINGLE;
The Onsemi FODM452R2 is a single optocoupler with a max forward current of 0.025A and isolation voltage of 3750V. Ideal for logic IC output applications, it operates b/w -40 to 85°C, with a min CTR of 15% and data rate of 1MBps.
FODM452R2V
The Onsemi FODM452R2V is a single optocoupler with a max forward current of 0.025A and isolation voltage of 3750V. It operates b/w -40 to 85°C, suitable for logic IC output applications at up to 1MBps data rate in surface mount configurations.
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Maximum Forward Current: .025 A; Maximum Operating Temperature: 85 Cel; Minimum Current Transfer Ratio: 15 %;
FODM611R2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Nominal Data Rate: 10 MBps; Nominal Response Time: 100 ns; Maximum Isolation Voltage: 3750 V;
FODM611R2 by Onsemi is a single optocoupler circuit output with a max forward current of 0.05 A. It is commonly used in logic IC output applications, offering a nominal data rate of 10 MBps and max isolation voltage of 3750 V.
FODM452
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Maximum Forward Voltage: 1.8 V; Maximum Operating Temperature: 85 Cel; Maximum Power Dissipation: .1 W;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Maximum Isolation Voltage: 3750 V; No. of Elements: 1; No. of Functions: 1;
FODM453R2V
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Maximum Forward Current: .025 A; Maximum Power Dissipation: .1 W; Additional Features: CMOS COMPATIBLE, UL RECOGNIZED, VDE APPROVED;
FODM453R2V by Onsemi is a single optocoupler circuit output with a max forward current of 0.025 A. It is commonly used in logic IC output applications, offering a min operating temperature of -40°C and max isolation voltage of 3750 V.
FODM8061R2V
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: MATTE TIN; Maximum Forward Current: .05 A; Minimum Supply Voltage: 3 V; No. of Elements: 1; Additional Features: CMOS COMPATIBLE;
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: MATTE TIN; Nominal Data Rate: 10 MBps; JESD-609 Code: e3; Maximum Forward Current: .05 A; Minimum Operating Temperature: -40 Cel;
FODM453R2
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel; Configuration: SINGLE; No. of Functions: 1; Maximum Forward Current: .025 A;
FODM453
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Minimum Current Transfer Ratio: 15 %; Additional Features: CMOS COMPATIBLE, UL RECOGNIZED; Maximum Operating Temperature: 85 Cel;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Maximum Forward Voltage: 1.8 V; Maximum Power Dissipation: .1 W; Maximum Isolation Voltage: 3750 V;
FODM453R1
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Maximum Power Dissipation: .1 W; Maximum On State Current: .008 A; No. of Elements: 1;
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