Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FODM453R2V by Onsemi is a single optocoupler circuit output with a max forward current of 0.025 A. It is commonly used in logic IC output applications, offering a min operating temperature of -40°C and max isolation voltage of 3750 V.
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$1.485
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This product has a single configuration, making it easy to integrate into various electronic systems.
With one function, this optocoupler circuit output is designed to be simple and straightforward to use.
This product has a maximum forward current of 0.025 A, allowing it to handle higher loads and provide reliable performance.
The optoelectronic type of this circuit output is specifically designed for logic IC outputs, ensuring accurate and efficient signal transmission.
This product can operate safely at temperatures up to 85°C, making it suitable for various environments and applications.
Even at low temperatures as low as -40°C, this optocoupler circuit output can function reliably, providing flexibility in different operating conditions.
The matte tin terminal finish not only provides excellent conductivity but also protects against corrosion, ensuring long-term reliability and durability.
With a maximum power dissipation of 0.1 W, this product can effectively handle power requirements, allowing for efficient and stable operation.
The minimum current transfer ratio of 15% ensures accurate and reliable signal transmission between input and output, making this optocoupler circuit output an ideal choice for critical applications.
This product consists of a single element, simplifying the design and integration process.
With a maximum isolation voltage of 3750 V, this optocoupler circuit output provides excellent electrical isolation, ensuring safe and reliable operation in high-voltage applications.
The nominal data rate of 1 MBps enables fast and efficient data transmission, making this product suitable for applications that require high-speed communication.
The surface mounting feature allows for easy and secure installation on printed circuit boards, saving space and facilitating mass production.
With a maximum forward voltage of 1.8 V, this product offers low power consumption and efficient signal transmission.
The maximum on-state current of 0.008 A enables this circuit output to handle larger current loads reliably, making it a versatile choice for various applications.
Optocoupler Circuit Outputs FODM453R2V attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi
Additional Features:
Configuration:
Minimum Current Transfer Ratio:
Nominal Data Rate:
Maximum Forward Current:
Maximum Forward Voltage:
Maximum Isolation Voltage:
JESD-609 Code:
Mounting Feature:
No. of Elements:
No. of Functions:
Maximum On State Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optoelectronic Type:
Maximum Power Dissipation:
Sub-Category:
Terminal Finish:
FODM453R2V Optoelectronics trade compliance attributes, and parameters.
HTS
8541.40.80.00
SB
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BAV99
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
Telcom Semiconductor
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
AT90CAN128-16AU
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
SMBJ18CA
Eic Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Micro Commercial Components
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
Solid State Devices
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Grande Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
North American Philips Discrete Products Div
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
HCPL2531S
Onsemi
HCPL2531S by Onsemi is a logic IC output optocoupler with 2 separate channels. It has a max forward current of 0.025A and an isolation voltage of 2500V, making it suitable for high-speed data transmission applications. With a response time of 450ns and a data rate of 1MBps, this rectangular-shaped optocoupler is ideal for surface mount configurations in various electronic circuits.
6N137S(TA)-V
Everlight Electronics
6N137S(TA)-V by Everlight Electronics is a single optocoupler with max. forward current of 0.05 A and isolation voltage of 5000 V. With a response time of 40 ns, it operates b/w -40 to 85°C. Ideal for logic IC output applications at data rates up to 10 MBps using surface mount technology.
HCPL0501
HCPL0501 by Onsemi is a single optocoupler with a max forward current of 0.025 A and isolation voltage of 2500 V. It operates b/w -40 to 85 °C, suitable for logic IC output applications at data rates up to 1 MBps in surface mount configurations.
5962-89785022A
Micropac Industries
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: TIN LEAD; Maximum Forward Current: .01 A; Maximum Forward Voltage: 1.8 V; Maximum Power Dissipation: .1 W;
6N136S(TB)-V
6N136S(TB)-V by Everlight Electronics is a single optocoupler circuit output with a max forward current of 0.025 A. It has a nominal response time of 30 ns and can operate in temperatures ranging from -55 to 100 °C. This optocoupler is commonly used in logic IC output applications requiring high isolation voltage and surface mount mounting feature.
Broadcom
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Maximum Forward Current: .01 A; Minimum Current Transfer Ratio: 200 %; Additional Features: OPEN COLLECTOR, HIGH RELIABILITY; Maximum Isolation Voltage: 1500 V;
TLP2770(TP,E(O
Toshiba
Toshiba's TLP2770(TP,E(O optocoupler features 5000V isolation voltage, 20MBps data rate, and -40 to 125°C operating temperature range. Ideal for logic IC output applications requiring fast response time of 1.3ns in a surface mount configuration.
6N135
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Maximum On State Current: .025 A; Nominal Data Rate: 1 MBps; Maximum Forward Current: .025 A; Configuration: SINGLE;
HCPL0639
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel; Additional Features: CMOS COMPATIBLE, UL RECOGNIZED; Nominal Response Time: 100 ns;
HCPL-2630
Hewlett Packard
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 2; JESD-609 Code: e0; Minimum Supply Voltage: 4.5 V; Maximum Forward Current: .015 A;
5962-8957101PA
Defense Logistics Agency
Defense Logistics Agency's 5962-8957101PA is a complex optocoupler with 2 functions. It has a max forward current of 0.01A and operates b/w -55 to 125°C. With a data rate of 40MBps, it is ideal for logic IC output applications.
6N139
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Power Dissipation: .1 W; Minimum Operating Temperature: 0 Cel;
HCPL-2631-000E
Agilent Technologies
Optocoupler - IC Outputs; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel; No. of Elements: 2; Maximum Power Dissipation: .06 W;
5962-8981001XA
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Additional Features: OPEN COLLECTOR, HIGH RELIABILITY; Maximum Power Dissipation: .05 W; No. of Elements: 1; Maximum On State Current: .04 A;
FODM8071
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Matte Tin (Sn); Additional Features: CMOS COMPATIBLE, UL RECOGNIZED; Configuration: SINGLE; JESD-609 Code: e3; Maximum On State Current: .01 A;
ACNV2601-500E
ACNV2601-500E by Broadcom is a SINGLE optocoupler with 10 MBps data rate, 7500 V isolation voltage, and 0.05 A on-state current. Ideal for logic IC output applications requiring fast response time and surface mounting feature.
HCPL-2232-300E
Optocoupler - IC Outputs; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: -40 Cel; Maximum Isolation Voltage: 3750 V; Nominal Response Time: 300 ns; Maximum Forward Current: .02 A;
6N140A/883B#200
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Maximum On State Current: .04 A; Maximum Forward Current: .01 A; Configuration: COMPLEX;
HCPL-2631-300E
Broadcom's HCPL-2631-300E is a 2-channel optocoupler with separate configuration. It has a max forward current of 0.015A and operates at temperatures ranging from -40 to 85°C. Ideal for logic IC output applications, it offers an isolation voltage of 3750V and data rate of 10MBps.
HCPL-0600-060
Broadcom's HCPL-0600-060 is a single optocoupler with a max forward current of 0.02A and isolation voltage of 3750V. Ideal for logic IC output applications, it operates b/w -40 to 85°C, with a nominal response time of 100ns. Suitable for surface mounting, it has a data rate of 10MBps and power dissipation of 0.085W.
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FODM8071R2
The Onsemi FODM8071R2 is a single optocoupler with a max forward current of 0.02A and isolation voltage of 3750V. With logic IC output, it operates b/w -40 to 110°C, ideal for high-speed data transmission at 20MBps in surface mount applications.
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Matte Tin (Sn); JESD-609 Code: e3; Nominal Data Rate: 20 MBps; Maximum Operating Temperature: 110 Cel; Minimum Supply Voltage: 3 V;
The Onsemi FODM8071 is a single optocoupler with a max forward current of 0.02 A and an isolation voltage of 3750 V. With a nominal data rate of 20 MBps, it is ideal for logic IC output applications. Operating b/w -40 to 110 °C, this surface mount device has a fast response time of 55 ns.
FODM452R2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel; No. of Elements: 1; Configuration: SINGLE;
The Onsemi FODM452R2 is a single optocoupler with a max forward current of 0.025A and isolation voltage of 3750V. Ideal for logic IC output applications, it operates b/w -40 to 85°C, with a min CTR of 15% and data rate of 1MBps.
FODM452R2V
The Onsemi FODM452R2V is a single optocoupler with a max forward current of 0.025A and isolation voltage of 3750V. It operates b/w -40 to 85°C, suitable for logic IC output applications at up to 1MBps data rate in surface mount configurations.
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Maximum Forward Current: .025 A; Maximum Operating Temperature: 85 Cel; Minimum Current Transfer Ratio: 15 %;
FODM611R2
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Nominal Data Rate: 10 MBps; Nominal Response Time: 100 ns; Maximum Isolation Voltage: 3750 V;
FODM611R2 by Onsemi is a single optocoupler circuit output with a max forward current of 0.05 A. It is commonly used in logic IC output applications, offering a nominal data rate of 10 MBps and max isolation voltage of 3750 V.
FODM452
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Maximum Forward Voltage: 1.8 V; Maximum Operating Temperature: 85 Cel; Maximum Power Dissipation: .1 W;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Maximum Isolation Voltage: 3750 V; No. of Elements: 1; No. of Functions: 1;
FODM453R2V
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Maximum Forward Current: .025 A; Maximum Power Dissipation: .1 W; Additional Features: CMOS COMPATIBLE, UL RECOGNIZED, VDE APPROVED;
FODM8061R2V
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: MATTE TIN; Maximum Forward Current: .05 A; Minimum Supply Voltage: 3 V; No. of Elements: 1; Additional Features: CMOS COMPATIBLE;
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: MATTE TIN; Nominal Data Rate: 10 MBps; JESD-609 Code: e3; Maximum Forward Current: .05 A; Minimum Operating Temperature: -40 Cel;
FODM453R2
LOGIC IC OUTPUT OPTOCOUPLER; Terminal Finish: Matte Tin (Sn); Minimum Operating Temperature: -40 Cel; Configuration: SINGLE; No. of Functions: 1; Maximum Forward Current: .025 A;
The Onsemi FODM453R2 is a single optocoupler with a max forward current of 0.025A and logic IC output type. It operates b/w -40 to 85°C, has an isolation voltage of 3750V, and data rate of 1MBps. Ideal for surface mount applications requiring high isolation and low power dissipation.
FODM453
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Minimum Current Transfer Ratio: 15 %; Additional Features: CMOS COMPATIBLE, UL RECOGNIZED; Maximum Operating Temperature: 85 Cel;
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: MATTE TIN; Maximum Forward Voltage: 1.8 V; Maximum Power Dissipation: .1 W; Maximum Isolation Voltage: 3750 V;
FODM453R1
LOGIC IC OUTPUT OPTOCOUPLER; Mounting Feature: SURFACE MOUNT; Terminal Finish: Matte Tin (Sn); Maximum Power Dissipation: .1 W; Maximum On State Current: .008 A; No. of Elements: 1;
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