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FODM3023R2

Onsemi

FODM3023R2 by Onsemi

FODM3023R2 by Onsemi is a single TRIAC output optocoupler with a max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 °C to 100°C, has an isolation voltage of 3750V, and is suitable for applications requiring optocoupler trigger device outputs in surface mount configurations.

Median Price

$0.520

Lifecycle Status

Suppliers In-Stock

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Vyrian

USA . 934 parts In-Stock

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Bristol Electronics

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Dan-Mar Components

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Ampacity Inc.

Singapore . 527 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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SupplyDigital Components

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Problanco Electronics

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Kulean Microsystems

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Northwest PG Solutions

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Corphita

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Authorized Procurement Solutions

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Metaverse IC Inc.

Canada . 796 parts In-Stock

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Supply Digital

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TANS Electronics

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Corohmni

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Overview

Experience the superior quality and reliability of Onsemi with the FODM3023R2 Optocoupler Trigger Device Outputs. Designed for precision and efficiency, this optoelectronic TRIAC OUTPUT OPTOCOUPLER offers unmatched performance in a wide range of applications. From industrial control systems to automotive electronics, this single configuration device delivers exceptional value and benefits to customers. With a maximum isolation voltage of 3750V and operating temperatures ranging from -40 °C to 100°C, the FODM3023R2 ensures optimal functionality and peace of mind in any environment. Elevate your projects with the trusted expertise of Onsemi.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low voltage drop when the device is on, leading to efficient power usage.

Configuration: SINGLE

Simplified design and wiring due to single configuration.

Maximum Forward Current: 0.06 A

Capable of handling moderate current loads effectively.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler provides reliable isolation and switching capabilities.

Maximum Operating Temperature: 100 °C

Wide operating temperature range suitable for various environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperature conditions.

Maximum Input Trigger Current: 0.005 A

Low trigger current required for activation, ensuring efficient operation.

Repetitive Off-state Voltage (Peak): 400 V

High off-state voltage rating provides safety and reliability.

Packing Method: TR, 13 INCH

Standard packing method for easy handling and storage.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current for minimal power loss.

Maximum Isolation Voltage: 3750 V

High isolation voltage for enhanced safety and protection against voltage surges.

Mounting Feature: SURFACE MOUNT

Surface mount design facilitates easy installation and space-saving.

Maximum On State Current: 0.07 A

Capable of handling slightly higher currents for versatility in applications.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3023R2 attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR, 13 INCH

Repetitive Off-state Voltage (Peak):

400 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3023R2 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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