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FODM3012V

Onsemi

FODM3012V by Onsemi

FODM3012V by Onsemi is a single TRIAC output optocoupler with a max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 °C to 100°C, has an isolation voltage of 3750V, and is ideal for applications requiring optocoupler trigger device outputs in surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,131 parts In-Stock

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Digiode

USA . 2,267 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 575 parts In-Stock

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$0.425

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$0.408

575

$0.425

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$0.408

Northwest PG Solutions

USA . 488 parts In-Stock

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$0.468

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$0.412

488

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$0.412

Component Stockers USA

USA . 630 parts In-Stock

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$99.990

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630

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 8,990 parts In-Stock

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8,990

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TANS Electronics

Latvia . 7,721 parts In-Stock

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Kulean Microsystems

USA . 4,758 parts In-Stock

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SupplyDigital Components

Austria . 4,598 parts In-Stock

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Corphita

USA . 1,725 parts In-Stock

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Problanco Electronics

Mexico . 1,287 parts In-Stock

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Supply Digital

USA . 1,237 parts In-Stock

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UHIMA Technologies

Türkiye . 549 parts In-Stock

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Corohmni

South Africa . 280 parts In-Stock

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Overview

Experience seamless and reliable performance with the FODM3012V by Onsemi, a high-quality optocoupler trigger device output that offers unparalleled precision and efficiency. Manufactured by the trusted brand Onsemi, this product guarantees top-notch quality and durability. Ideal for a wide range of applications, this optocoupler is designed to provide superior isolation and protection in various electronic circuits. Unlock the true potential of your projects with the FODM3012V and enjoy the peace of mind that comes with using a reliable and innovative product.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

The low on state voltage allows for efficient power conversion and helps in reducing power consumption.

Configuration: SINGLE

The single configuration simplifies the setup and makes it easy to integrate into various systems.

Maximum Forward Current: 0.06 A

The high forward current capability provides the product with the ability to handle larger loads.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

The TRIAC output optocoupler type ensures reliable switching and control of AC loads.

Maximum Operating Temperature: 100 °C

The high operating temperature range makes this product suitable for a wide range of environments and applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can perform efficiently even in cold environments.

Maximum Input Trigger Current: 0.005 A

The low input trigger current allows for easy interfacing with control devices.

Repetitive Off-state Voltage (Peak): 250 V

The high off-state voltage rating ensures safe operation and protection against voltage spikes.

Packing Method: TUBE

The tube packaging method provides convenient storage and transportation of the product.

Maximum Reverse Leakage Current: 0.0001 A

The low reverse leakage current contributes to energy efficiency and helps in maintaining stable operation.

Maximum Isolation Voltage: 3750 V

The high isolation voltage rating ensures safety and protection against electrical hazards.

Mounting Feature: SURFACE MOUNT

The surface mounting feature allows for easy and secure installation on circuit boards.

Maximum On State Current: 0.07 A

The high on state current rating provides the product with robust switching capabilities for demanding applications.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3012V attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3012V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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