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FODM3011R2

Onsemi

FODM3011R2 by Onsemi

FODM3011R2 by Onsemi is a single TRIAC output optocoupler with a max on-state voltage of 3V and forward current of 0.06A. It operates b/w -40 to 100 °C, has an isolation voltage of 3750V, and is ideal for applications requiring optocoupler trigger device outputs in surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,073 parts In-Stock

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Digiode

USA . 2,487 parts In-Stock

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$0.687

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$0.625

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$0.563

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$0.687

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Northwest PG Solutions

USA . 1,566 parts In-Stock

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$2.529

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QUARKTWIN TECHNOLOGY LTD

USA . 15,787 parts In-Stock

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SupplyDigital Components

Austria . 6,905 parts In-Stock

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Kulean Microsystems

USA . 6,465 parts In-Stock

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Problanco Electronics

Mexico . 5,431 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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Corphita

USA . 1,520 parts In-Stock

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TANS Electronics

Latvia . 1,410 parts In-Stock

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Native Components

USA . 894 parts In-Stock

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UHIMA Technologies

Türkiye . 350 parts In-Stock

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Corohmni

South Africa . 248 parts In-Stock

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Overview

Unlock a world of possibilities with the FODM3011R2 by Onsemi, the leading manufacturer in optocoupler trigger device outputs. This versatile component offers reliable performance, exceptional quality, and a wide range of applications, making it an essential choice for your project needs. With its maximum isolation voltage of 3750V and maximum forward current of 0.06A, this optocoupler provides unmatched value and benefits to customers seeking seamless integration and superior functionality. Upgrade your designs with the FODM3011R2 and experience the difference today.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low voltage requirement for the on state ensures compatibility with various electronic devices.

Configuration: SINGLE

Simplified single configuration setup for ease of use.

Maximum Forward Current: 0.06 A

Able to handle moderate current loads efficiently.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler offers reliable switching and isolation capabilities.

Maximum Operating Temperature: 100 °C

Wide operating temperature range allows for usage in various environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in low temperature conditions without issues.

Maximum Input Trigger Current: 0.01 A

Low input trigger current requirement for efficient operation.

Repetitive Off-state Voltage (Peak): 250 V

High off-state voltage tolerance for enhanced safety and reliability.

Packing Method: TR, 13 INCH

Secure packing method for safe transportation and handling.

Maximum Reverse Leakage Current: 0.0001 A

Extremely low reverse leakage current for improved efficiency.

Maximum Isolation Voltage: 3750 V

High isolation voltage rating for superior protection against voltage spikes.

Mounting Feature: SURFACE MOUNT

Surface mount design for easy installation and space-saving benefits.

Maximum On State Current: 0.07 A

Higher on-state current capacity for handling increased loads when required.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3011R2 attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.01 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TR, 13 INCH

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3011R2 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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