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FODM3083V

Onsemi

FODM3083V by Onsemi

The Onsemi FODM3083V is a single TRIAC output optocoupler with max forward current of 0.06A and isolation voltage of 3750V. It operates b/w -40 to 100 °C, suitable for triggering devices in various applications like motor controls and solid-state relays.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,296 parts In-Stock

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Vyrian

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Native Components

USA . 620 parts In-Stock

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$14.110

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620

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Northwest PG Solutions

USA . 2,341 parts In-Stock

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$15.521

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$13.969

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SupplyDigital Components

Austria . 5,058 parts In-Stock

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Corphita

USA . 1,704 parts In-Stock

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TANS Electronics

Latvia . 1,164 parts In-Stock

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Problanco Electronics

Mexico . 1,080 parts In-Stock

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Supply Digital

USA . 1,078 parts In-Stock

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Corohmni

South Africa . 142 parts In-Stock

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Kulean Microsystems

USA . 95 parts In-Stock

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UHIMA Technologies

Türkiye . 20 parts In-Stock

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Overview

Experience the power of innovation with the FODM3083V by Onsemi. As a leader in optocoupler trigger devices, Onsemi brings unparalleled quality and reliability to its products. The FODM3083V offers a single configuration with a maximum forward current of 0.06 A, making it ideal for a wide range of applications. With a maximum isolation voltage of 3750 V and a minimum operating temperature of -40 °C, this optocoupler provides exceptional performance in demanding environments. Trust Onsemi to deliver cutting-edge technology that exceeds expectations and unlocks new possibilities for your projects.

Feature Benefit Bullets

Configuration: SINGLE

SINGLE configuration simplifies the setup and installation process, making it user-friendly.

Maximum Forward Current: 0.06 A

High maximum forward current allows for reliable operation of the device under load.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler ensures efficient and accurate triggering of connected devices.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures durability and stability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows the device to be used in extreme conditions.

Maximum Input Trigger Current: 0.005 A

Low input trigger current helps in minimizing power consumption and heat generation.

Repetitive Off-state Voltage (Peak): 800 V

High off-state voltage capability ensures reliable isolation and protection.

Packing Method: TUBE

Tube packaging provides easy storage and handling of the product.

Maximum Reverse Leakage Current: 0.0001 A

Low reverse leakage current helps in enhancing the efficiency and performance of the device.

Minimum Peak Off-state Voltage: 800 V

High peak off-state voltage ensures reliable isolation and protection.

Maximum Isolation Voltage: 3750 V

High isolation voltage provides safety and protection against electrical hazards.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy and secure installation on circuit boards.

Maximum On State Current: 0.07 A

High maximum on-state current allows for efficient operation of connected devices.

Technical Specifications

Optocoupler Trigger Device Outputs FODM3083V attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED, VDE APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.005 A

Maximum Isolation Voltage:

3750 V

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.07 A

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

800 V

Repetitive Off-state Voltage (Peak):

800 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

FODM3083V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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