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MOC3010SVM

Onsemi

MOC3010SVM by Onsemi

The Onsemi MOC3010SVM is a single TRIAC output optocoupler with a max on-state voltage of 3V and peak surge current of 1A. It operates b/w -40 °C to 85°C, with an isolation voltage of 4170V, making it ideal for triggering devices in various applications requiring high-voltage protection.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 3,233 parts In-Stock

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Vyrian

USA . 2,246 parts In-Stock

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Andel Nordic

Denmark . 352 parts In-Stock

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$7.915

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$7.598

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$7.598

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$7.598

Component Stockers USA

USA . 676 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 20,610 parts In-Stock

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TANS Electronics

Latvia . 7,243 parts In-Stock

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Kulean Microsystems

USA . 4,408 parts In-Stock

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Corphita

USA . 2,685 parts In-Stock

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Supply Digital

USA . 2,538 parts In-Stock

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SupplyDigital Components

Austria . 2,515 parts In-Stock

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Problanco Electronics

Mexico . 2,313 parts In-Stock

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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UHIMA Technologies

Türkiye . 191 parts In-Stock

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Corohmni

South Africa . 122 parts In-Stock

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Overview

Unlock the power of precision and reliability with the MOC3010SVM by Onsemi. As a leader in optocoupler trigger device outputs, Onsemi delivers unparalleled quality and performance. This versatile product is ideal for a wide range of applications, offering customers a seamless experience with its single configuration, low forward current, and high isolation voltage. Trust Onsemi to provide you with cutting-edge technology that exceeds your expectations and enhances your projects. Elevate your work with the MOC3010SVM and experience the difference today.

Feature Benefit Bullets

Maximum On State Voltage: 3 V

Low on-state voltage allows for efficient operation and minimizes power consumption.

Configuration: SINGLE

Simplified single configuration for ease of use and installation.

Peak Surge Current: 1 A

High surge current capability ensures reliable performance under transient conditions.

Maximum Forward Current: 0.06 A

Suitable for low to moderate current applications while maintaining efficiency.

Optoelectronic Type: TRIAC OUTPUT OPTOCOUPLER

Triac output optocoupler design allows for reliable switching of AC loads.

Maximum Operating Temperature: 85 °C

Wide operating temperature range provides versatility for various environments.

Minimum Operating Temperature: -40 °C

Operational at low temperatures, suitable for cold environments.

Maximum Input Trigger Current: 0.015 A

Low trigger current for efficient operation and control.

Repetitive Off-state Voltage (Peak): 250 V

High off-state voltage rating ensures reliable isolation of the circuit.

Packing Method: TUBE

Convenient tube packaging for easy storage and handling.

Maximum Reverse Leakage Current: 0.0001 A

Negligible reverse leakage current for high reliability.

Minimum Peak Off-state Voltage: 250 V

High off-state voltage rating ensures reliable isolation of the circuit.

Maximum Isolation Voltage: 4170 V

High isolation voltage for enhanced safety and protection.

Mounting Feature: SURFACE MOUNT

Surface mount design for easy and efficient installation on PCBs.

Technical Specifications

Optocoupler Trigger Device Outputs MOC3010SVM attributes and parameters. Explore more Optocoupler Trigger Device Outputs devices from Onsemi

Specs

Additional Features:

IEC-60747-5-5, UL APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.06 A

Maximum Input Trigger Current:

.015 A

Maximum Isolation Voltage:

4170 V

Mounting Feature:

No. of Elements:

1

Maximum On State Voltage:

3 V

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Minimum Peak Off-state Voltage:

250 V

Peak Surge Current:

1 A

Repetitive Off-state Voltage (Peak):

250 V

Maximum Reverse Leakage Current:

.0001 A

Trade Compliance

MOC3010SVM Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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