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FODM214AR2

Onsemi

FODM214AR2 by Onsemi

The Onsemi FODM214AR2 is a single optocoupler with AC input-transistor output. It has a max forward current of 0.05A, min operating temp of -55°C, and max isolation voltage of 3750V. Ideal for applications requiring high voltage isolation and signal transmission in harsh environments.

Median Price

$0.694

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,342 parts In-Stock

1+ parts

$0.660

100+ parts

$0.329

1k+ parts

$0.250

10k+ parts

$0.195

2,342

$0.660

$0.329

$0.250

$0.195

DigiKey

USA . 1,770 parts In-Stock

1+ parts

$0.660

100+ parts

$0.329

1k+ parts

$0.255

10k+ parts

$0.213

1,770

$0.660

$0.329

$0.255

$0.213

Arrow

USA . 3,000 parts In-Stock

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-

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$0.727

3,000

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$0.727

Verical

USA . 3,000 parts In-Stock

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$0.727

3,000

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$0.727

Distributors (In-Stock)

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Digiode

USA . 291 parts In-Stock

1+ parts

$0.684

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291

$0.684

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Vyrian

USA . 1,927 parts In-Stock

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1,927

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Distributors (Availability)

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Native Components

USA . 626 parts In-Stock

1+ parts

$0.126

100+ parts

-

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$0.121

626

$0.126

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$0.121

Northwest PG Solutions

USA . 1,941 parts In-Stock

1+ parts

$0.139

100+ parts

-

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$0.123

1,941

$0.139

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$0.123

Corphita

USA . 52 parts In-Stock

1+ parts

$0.648

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52

$0.648

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Ampacity Inc.

Singapore . 1,891 parts In-Stock

1+ parts

$0.670

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1,891

$0.670

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Component Stockers USA

USA . 2,751 parts In-Stock

1+ parts

$0.700

100+ parts

$0.300

1k+ parts

$0.240

10k+ parts

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2,751

$0.700

$0.300

$0.240

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Corohmni

South Africa . 244 parts In-Stock

1+ parts

$0.720

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244

$0.720

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SupplyDigital Components

Austria . 7,482 parts In-Stock

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Problanco Electronics

Mexico . 6,480 parts In-Stock

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TANS Electronics

Latvia . 3,444 parts In-Stock

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Kulean Microsystems

USA . 3,330 parts In-Stock

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Lixinc

USA . 2,797 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,038 parts In-Stock

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2,038

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 722 parts In-Stock

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722

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Overview

Experience the seamless performance and reliability of the FODM214AR2 optocoupler transistor output by Onsemi. This high-quality component offers unparalleled value with a single configuration, wide operating temperature range, and impressive isolation voltage. Perfect for applications in industrial control systems, power supplies, and motor drives, this product ensures precision and efficiency in every use. Trust Onsemi's expertise and innovation to deliver exceptional results for your electronic projects. Elevate your designs with the FODM214AR2 and experience the difference today.

Feature Benefit Bullets

Configuration: SINGLE

Having a single configuration simplifies the installation and integration process.

Maximum Forward Current: 0.05 A

Capable of handling up to 0.05 A of current, making it suitable for a variety of applications.

Optoelectronic Type: AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER

Designed for AC input with transistor output, providing versatility in use.

Maximum Operating Temperature: 110 °C

Can operate effectively in high temperature environments.

Minimum Operating Temperature: -55 °C

Capable of functioning in low temperature conditions as well.

Terminal Finish: MATTE TIN

Matte tin finish ensures good electrical conductivity and corrosion resistance.

Maximum Power Dissipation: 0.15 W

Efficiently dissipates up to 0.15 W of power, preventing overheating.

Minimum Current Transfer Ratio: 50 %

Provides reliable signal transfer with a minimum ratio of 50%.

Maximum Dark Current: 100 nA

Low dark current ensures minimal leakage current when the device is off.

Packing Method: TR

TR packing method offers convenience in storage and handling.

Minimum Collector-emitter Breakdown Voltage: 80 V

Capable of withstanding up to 80 V without breakdown.

Maximum Isolation Voltage: 3750 V

Provides high isolation voltage for enhanced safety and protection.

Mounting Feature: SURFACE MOUNT

Surface mountable, enabling easy and secure installation on PCBs.

Maximum Forward Voltage: 1.4 V

Low forward voltage ensures efficient operation and minimal power loss.

Maximum On State Current: 0.05 A

Capable of handling up to 0.05 A of on-state current, suitable for various applications.

Technical Specifications

Optocoupler Transistor Outputs FODM214AR2 attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Minimum Collector-emitter Breakdown Voltage:

80 V

Configuration:

SINGLE

Minimum Current Transfer Ratio:

50 %

Maximum Dark Current:

100 nA

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.4 V

Maximum Isolation Voltage:

3750 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.05 A

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-55 Cel

Packing Method:

TR

Maximum Power Dissipation:

.15 W

Terminal Finish:

Trade Compliance

FODM214AR2 Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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