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FODM214A

Onsemi

FODM214A by Onsemi

The Onsemi FODM214A is a single optocoupler with AC input-transistor output. It has a max forward current of 0.05 A, min operating temp of -55 °C, and max isolation voltage of 3750 V. Ideal for applications requiring high isolation voltage and low power dissipation in surface mount configurations.

Median Price

$0.431

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,163 parts In-Stock

1+ parts

$0.640

100+ parts

$0.318

1k+ parts

$0.246

10k+ parts

$0.187

3,163

$0.640

$0.318

$0.246

$0.187

DigiKey

USA . 803 parts In-Stock

1+ parts

$0.640

100+ parts

$0.318

1k+ parts

$0.246

10k+ parts

$0.211

803

$0.640

$0.318

$0.246

$0.211

Future Electronics

Canada . 6,000 parts In-Stock

1+ parts

-

100+ parts

$0.126

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-

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$0.123

6,000

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$0.126

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$0.123

Rochester

USA . 200 parts In-Stock

1+ parts

-

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$0.222

1k+ parts

$0.184

10k+ parts

$0.164

200

-

$0.222

$0.184

$0.164

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,103 parts In-Stock

1+ parts

$0.172

100+ parts

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2,103

$0.172

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IBS Electronics

USA . 6,000 parts In-Stock

1+ parts

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$0.160

6,000

-

-

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$0.160

NAC Semi

USA . 4,800 parts In-Stock

1+ parts

-

100+ parts

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$0.210

10k+ parts

$0.194

4,800

-

-

$0.210

$0.194

Vyrian

USA . 3,702 parts In-Stock

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3,702

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Flip Electronics

USA . 2,953 parts In-Stock

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2,953

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Distributors (Availability)

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Corphita

USA . 305 parts In-Stock

1+ parts

$0.163

100+ parts

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305

$0.163

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Corohmni

South Africa . 23 parts In-Stock

1+ parts

$0.436

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23

$0.436

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Advanced Electronics

New Zealand . 20 parts In-Stock

1+ parts

$0.648

100+ parts

$0.590

1k+ parts

$0.531

10k+ parts

-

20

$0.648

$0.590

$0.531

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Native Components

USA . 824 parts In-Stock

1+ parts

$37.990

100+ parts

-

1k+ parts

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10k+ parts

$36.470

824

$37.990

-

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$36.470

Northwest PG Solutions

USA . 770 parts In-Stock

1+ parts

$41.789

100+ parts

-

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770

$41.789

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QUARKTWIN TECHNOLOGY LTD

USA . 7,992 parts In-Stock

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Problanco Electronics

Mexico . 7,838 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Kulean Microsystems

USA . 2,747 parts In-Stock

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2,747

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TANS Electronics

Latvia . 961 parts In-Stock

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961

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UHIMA Technologies

Türkiye . 738 parts In-Stock

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738

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SupplyDigital Components

Austria . 143 parts In-Stock

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Overview

Discover the exceptional quality and reliability of the FODM214A optocoupler transistor output from Onsemi. This innovative component offers a wide range of applications, providing seamless isolation between input and output circuits. With superior performance and a high current transfer ratio, this product ensures precise signal transmission while maintaining maximum safety. Trust Onsemi's reputation for excellence and choose the FODM214A for all your optocoupler needs. Unlock the potential of your designs with this cutting-edge solution that delivers unmatched value and benefits to customers.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration makes it easy to integrate into circuits and reduces complexity during installation.

Maximum Forward Current: 0.05 A

With a high maximum forward current, this optocoupler can handle heavy loads without overheating or malfunctioning.

Optoelectronic Type: AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER

This type of optocoupler is versatile and can be used in various applications that require AC input and transistor output.

Maximum Operating Temperature: 110 °C

The high maximum operating temperature ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows this optocoupler to be used in a wide range of temperature environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity and ensures a reliable connection.

Maximum Power Dissipation: 0.15 W

With low power dissipation, this optocoupler operates efficiently and does not waste unnecessary energy.

Minimum Current Transfer Ratio: 50 %

The high minimum current transfer ratio ensures accurate signal transmission between input and output.

Maximum Dark Current: 100 nA

Low dark current minimizes leakage current and ensures proper operation even in low light conditions.

Packing Method: TUBE

Tube packing method provides protection during transportation and storage, reducing the risk of damage to the optocoupler.

Minimum Collector-emitter Breakdown Voltage: 80 V

High breakdown voltage protects the optocoupler from voltage spikes and prevents damage to the circuit.

Maximum Isolation Voltage: 3750 V

High isolation voltage ensures safety and prevents interference between input and output circuits.

Mounting Feature: SURFACE MOUNT

Surface mounting feature allows for easy and secure installation on PCBs, saving space and reducing assembly time.

Maximum Forward Voltage: 1.4 V

Low forward voltage drop ensures efficient operation and minimal power loss in the circuit.

Maximum On State Current: 0.05 A

High maximum on-state current allows the optocoupler to handle heavy loads without compromising performance.

Technical Specifications

Optocoupler Transistor Outputs FODM214A attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED

Minimum Collector-emitter Breakdown Voltage:

80 V

Configuration:

SINGLE

Minimum Current Transfer Ratio:

50 %

Maximum Dark Current:

100 nA

Maximum Forward Current:

.05 A

Maximum Forward Voltage:

1.4 V

Maximum Isolation Voltage:

3750 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum On State Current:

.05 A

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-55 Cel

Packing Method:

TUBE

Maximum Power Dissipation:

.15 W

Terminal Finish:

Trade Compliance

FODM214A Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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