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FOD3150ASDV

Onsemi

FOD3150ASDV by Onsemi

FOD3150ASDV by Onsemi is a SINGLE optocoupler with a max forward current of 0.025A and isolation voltage of 5000V. Ideal for applications requiring FET OUTPUT OPTOCOUPLER, it operates b/w -40 to 100 °C, with a matte tin finish and surface mounting feature.

Median Price

$1.614

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$2.160

100+ parts

$1.186

1k+ parts

$0.974

10k+ parts

$0.851

1,000

$2.160

$1.186

$0.974

$0.851

Mouser Electronics

USA . 996 parts In-Stock

1+ parts

$2.160

100+ parts

$1.190

1k+ parts

$0.959

10k+ parts

$0.816

996

$2.160

$1.190

$0.959

$0.816

Rochester

USA . 2,220 parts In-Stock

1+ parts

-

100+ parts

$1.030

1k+ parts

$0.855

10k+ parts

$0.762

2,220

-

$1.030

$0.855

$0.762

Verical

USA . 2,220 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.069

10k+ parts

-

2,220

-

-

$1.069

-

Flip Electronics (Authorized)

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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2,000

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,495 parts In-Stock

1+ parts

$0.805

100+ parts

-

1k+ parts

-

10k+ parts

-

2,495

$0.805

-

-

-

Vyrian

USA . 6,955 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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6,955

-

-

-

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Flip Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,000

-

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,777 parts In-Stock

1+ parts

$0.762

100+ parts

-

1k+ parts

-

10k+ parts

-

1,777

$0.762

-

-

-

Corohmni

South Africa . 393 parts In-Stock

1+ parts

$0.847

100+ parts

-

1k+ parts

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10k+ parts

-

393

$0.847

-

-

-

Native Components

USA . 528 parts In-Stock

1+ parts

$221.180

100+ parts

$216.756

1k+ parts

$214.545

10k+ parts

$212.333

528

$221.180

$216.756

$214.545

$212.333

Northwest PG Solutions

USA . 1,585 parts In-Stock

1+ parts

$243.298

100+ parts

-

1k+ parts

-

10k+ parts

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1,585

$243.298

-

-

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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SupplyDigital Components

Austria . 7,186 parts In-Stock

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7,186

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TANS Electronics

Latvia . 2,457 parts In-Stock

1+ parts

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2,457

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Kulean Microsystems

USA . 1,558 parts In-Stock

1+ parts

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1,558

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Problanco Electronics

Mexico . 1,268 parts In-Stock

1+ parts

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1,268

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UHIMA Technologies

Türkiye . 945 parts In-Stock

1+ parts

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100+ parts

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945

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Overview

Discover the power of reliable and efficient optocoupler technology with the FOD3150ASDV by Onsemi. As a trusted manufacturer in the industry, Onsemi brings you a single configuration optocoupler transistor output that offers unparalleled quality and performance. Ideal for a wide range of applications, this optocoupler provides a maximum isolation voltage of 5000V, ensuring safe and secure operation. With its matte tin terminal finish and surface mounting feature, the FOD3150ASDV is easy to install and use. Experience the value and benefits of superior design and functionality with this innovative product from Onsemi.

Feature Benefit Bullets

Configuration: SINGLE

Single configuration simplifies installation and reduces complexity in circuit design.

Maximum Forward Current: 0.025 A

Can handle a maximum forward current of 0.025 A, making it suitable for low power applications.

Optoelectronic Type: FET OUTPUT OPTOCOUPLER

FET output optocoupler provides high speed and high voltage isolation for reliable signal transmission.

Maximum Operating Temperature: 100 °C

Can operate efficiently at a maximum temperature of 100°C, suitable for a wide range of environments.

Minimum Operating Temperature: -40 °C

Can operate at a minimum temperature of -40°C, making it suitable for harsh and cold climates.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin terminal finish provides good solderability and ensures a secure connection for reliable performance.

Maximum Power Dissipation: 0.25 W

With a maximum power dissipation of 0.25 W, it can handle power efficiently without overheating.

Packing Method: TUBE

Tube packing method ensures easy handling, storage, and transportation of the product.

Maximum Isolation Voltage: 5000 V

High isolation voltage of 5000 V ensures safe and reliable signal isolation in high voltage applications.

Mounting Feature: SURFACE MOUNT

Surface mounting feature makes installation easy and saves space on the PCB.

Maximum Forward Voltage: 1.8 V

Low maximum forward voltage of 1.8 V reduces power consumption and improves energy efficiency.

Technical Specifications

Optocoupler Transistor Outputs FOD3150ASDV attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Additional Features:

UL APPROVED, VDE APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.025 A

Maximum Forward Voltage:

1.8 V

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Packing Method:

TUBE

Maximum Power Dissipation:

.25 W

Terminal Finish:

Trade Compliance

FOD3150ASDV Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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