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FOD3120TSR2V

Onsemi

FOD3120TSR2V by Onsemi

FOD3120TSR2V by Onsemi is a FET output optocoupler with max forward current of 0.025A, isolation voltage of 5000V, and operating temperature range from -40 to 100°C. Ideal for applications requiring high voltage isolation in surface mount configurations.

Median Price

$1.200

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,556 parts In-Stock

1+ parts

$2.140

100+ parts

$1.220

1k+ parts

$0.972

10k+ parts

$0.971

1,556

$2.140

$1.220

$0.972

$0.971

DigiKey

USA . 1,209 parts In-Stock

1+ parts

$2.430

100+ parts

$1.353

1k+ parts

$1.146

10k+ parts

$0.998

1,209

$2.430

$1.353

$1.146

$0.998

Flip Electronics (Authorized)

USA . 11,200 parts In-Stock

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11,200

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Rochester

USA . 10,500 parts In-Stock

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$1.200

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$0.996

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$0.888

10,500

-

$1.200

$0.996

$0.888

Arrow

USA . 700 parts In-Stock

1+ parts

-

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$0.999

10k+ parts

$0.885

700

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-

$0.999

$0.885

Chip1Stop

Japan . 700 parts In-Stock

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$0.994

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700

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$0.994

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 804 parts In-Stock

1+ parts

$0.936

100+ parts

-

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804

$0.936

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IBS Electronics

USA . 20,300 parts In-Stock

1+ parts

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$0.792

10k+ parts

$0.778

20,300

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-

$0.792

$0.778

NAC Semi

USA . 16,100 parts In-Stock

1+ parts

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100+ parts

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$0.800

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16,100

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$0.800

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Flip Electronics

USA . 11,790 parts In-Stock

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Vyrian

USA . 4,752 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Martec Srl

Italy . 96 parts In-Stock

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96

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,383 parts In-Stock

1+ parts

$0.247

100+ parts

-

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10k+ parts

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4,383

$0.247

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Corohmni

South Africa . 334 parts In-Stock

1+ parts

$0.764

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334

$0.764

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Ampacity Inc.

Singapore . 4,680 parts In-Stock

1+ parts

$0.840

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4,680

$0.840

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Semicontronic

India . 4,572 parts In-Stock

1+ parts

$0.840

100+ parts

$0.819

1k+ parts

$0.815

10k+ parts

-

4,572

$0.840

$0.819

$0.815

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Corphita

USA . 1,618 parts In-Stock

1+ parts

$0.886

100+ parts

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1,618

$0.886

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Component Stockers USA

USA . 13,447 parts In-Stock

1+ parts

$1.010

100+ parts

$0.950

1k+ parts

$0.860

10k+ parts

$0.860

13,447

$1.010

$0.950

$0.860

$0.860

Problanco Electronics

Mexico . 8,141 parts In-Stock

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8,141

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SupplyDigital Components

Austria . 7,410 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,286 parts In-Stock

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TANS Electronics

Latvia . 6,364 parts In-Stock

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Continental Prestige Electronics

USA . 5,839 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Eastek

USA . 700 parts In-Stock

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700

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Argo Parts USA

USA . 259 parts In-Stock

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Perfect Parts

USA . 203 parts In-Stock

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Kulean Microsystems

USA . 195 parts In-Stock

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195

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Supply Digital

USA . 170 parts In-Stock

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170

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Bastille Electronics

Australia . 100 parts In-Stock

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UHIMA Technologies

Türkiye . 92 parts In-Stock

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Enhance your electronic designs with the FOD3120TSR2V by Onsemi, a top-quality optocoupler transistor output that guarantees reliability and precision. Manufactured by Onsemi, a renowned industry leader, this component is versatile and ideal for a wide range of applications. Experience seamless performance and peace of mind knowing that this product offers exceptional value, benefits, and advantages to customers. Upgrade your projects with the FOD3120TSR2V and unlock endless possibilities in the world of electronics.

Feature Benefit Bullets

Maximum Forward Current: 0.025 A

Low current consumption makes this optocoupler energy-efficient and suitable for applications requiring low power consumption.

Optoelectronic Type: FET OUTPUT OPTOCOUPLER

FET output optocoupler provides high-speed switching and excellent noise immunity, making it ideal for applications where signal integrity is crucial.

Maximum Operating Temperature: 100 °C

High operating temperature range ensures reliable performance in a variety of environments, making this optocoupler suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range allows this optocoupler to function effectively in both cold and hot conditions, increasing its versatility.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Power Dissipation: 0.25 W

Low power dissipation helps in minimizing heat generation, which is essential for maintaining the optocoupler's performance and longevity.

Maximum Isolation Voltage: 5000 V

High isolation voltage rating enhances safety by preventing electrical interference and protecting sensitive components from voltage spikes.

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies the installation process and saves space on the PCB, making it suitable for compact electronic devices.

Maximum Forward Voltage: 1.8 V

Low forward voltage drop ensures efficient operation and helps in reducing power consumption, making this optocoupler energy-efficient.

Technical Specifications

Optocoupler Transistor Outputs FOD3120TSR2V attributes and parameters. Explore more Optocoupler Transistor Outputs devices from Onsemi

Specs

Maximum Forward Current:

.025 A

Maximum Forward Voltage:

1.8 V

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.25 W

Sub-Category:

Optocoupler - Transistor Outputs

Terminal Finish:

Trade Compliance

FOD3120TSR2V Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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