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FDS3580

Onsemi

FDS3580 by Onsemi

FDS3580 by Onsemi is a N-CHANNEL FET with 80V DS Breakdown Voltage, ideal for SWITCHING applications. It features a single configuration with built-in diode, GULL WING terminals, and 7.6A max Drain Current. Operating in ENHANCEMENT MODE, it has a max Power Dissipation of 2.5W and can withstand temperatures up to 150°C.

Median Price

$1.593

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,476 parts In-Stock

1+ parts

$0.920

100+ parts

$0.900

1k+ parts

$0.880

10k+ parts

-

3,476

$0.920

$0.900

$0.880

-

DigiKey

USA . 8,997 parts In-Stock

1+ parts

$2.160

100+ parts

$0.938

1k+ parts

$0.715

10k+ parts

$0.584

8,997

$2.160

$0.938

$0.715

$0.584

Mouser Electronics

USA . 3,373 parts In-Stock

1+ parts

$2.160

100+ parts

$0.938

1k+ parts

$0.702

10k+ parts

$0.668

3,373

$2.160

$0.938

$0.702

$0.668

Flip Electronics (Authorized)

USA . 44,939 parts In-Stock

1+ parts

-

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44,939

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Verical

USA . 2,500 parts In-Stock

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-

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$1.026

2,500

-

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$1.026

Distributors (In-Stock)

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Vyrian

USA . 977 parts In-Stock

1+ parts

$0.600

100+ parts

-

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-

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977

$0.600

-

-

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Digiode

USA . 2,356 parts In-Stock

1+ parts

$1.092

100+ parts

-

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-

10k+ parts

-

2,356

$1.092

-

-

-

Flip Electronics

USA . 44,939 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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44,939

-

-

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Sensible Micro Corp

USA . 37,000 parts In-Stock

1+ parts

-

100+ parts

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37,000

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-

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

1+ parts

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10,000

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Bristol Electronics

USA . 913 parts In-Stock

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913

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Lantek

USA . 188 parts In-Stock

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188

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Prism Electronics

USA . 103 parts In-Stock

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103

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 11,212 parts In-Stock

1+ parts

$0.510

100+ parts

-

1k+ parts

-

10k+ parts

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11,212

$0.510

-

-

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Corohmni

South Africa . 79 parts In-Stock

1+ parts

$0.600

100+ parts

-

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79

$0.600

-

-

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Corphita

USA . 2,146 parts In-Stock

1+ parts

$1.035

100+ parts

-

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2,146

$1.035

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

1+ parts

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90,000

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RC Electronics

USA . 56,720 parts In-Stock

1+ parts

-

100+ parts

$0.750

1k+ parts

$0.680

10k+ parts

$0.660

56,720

-

$0.750

$0.680

$0.660

Perfect Parts

USA . 16,101 parts In-Stock

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16,101

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QUARKTWIN TECHNOLOGY LTD

USA . 15,252 parts In-Stock

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15,252

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Microchip USA

USA . 11,996 parts In-Stock

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11,996

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ChipstoGo Electronic ltd

UK . 10,000 parts In-Stock

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10,000

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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TANS Electronics

Latvia . 7,407 parts In-Stock

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7,407

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Kulean Microsystems

USA . 5,145 parts In-Stock

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5,145

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Problanco Electronics

Mexico . 4,124 parts In-Stock

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4,124

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Supply Digital

USA . 336 parts In-Stock

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336

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SupplyDigital Components

Austria . 296 parts In-Stock

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296

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UHIMA Technologies

Türkiye . 283 parts In-Stock

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283

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Overview

Discover the power of the FDS3580 by Onsemi, a top-quality Small Signal Field Effect Transistor designed for switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers unparalleled performance and reliability. Ideal for a wide range of electronic devices, this product boasts a maximum DS Breakdown Voltage of 80V and a Maximum Drain Current of 7.6A. Trust in Onsemi's expertise and craftsmanship to bring value and efficiency to your projects with the FDS3580. Elevate your designs with this cutting-edge technology and unleash the full potential of your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the transistor, ensuring its longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher efficiency compared to P-channel FETs, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances efficiency by reducing losses in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current in circuits.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto PCBs, saving space and facilitating automated assembly processes.

Maximum Drain Current (ID): 7.6 A

The high maximum drain current rating enables this FET to handle larger current loads, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.029 ohm

The low on-resistance minimizes power losses and heat dissipation, improving the efficiency and performance of the transistor.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can withstand demanding environmental conditions, ensuring reliable operation in various applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDS3580 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

7.6 A

Maximum Drain Current (ID):

7.6 A

Maximum Drain-Source On Resistance:

.029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDS3580 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

NSN

5961-01-642-3645, 5961016423645

NIIN

016423645

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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