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FDPC8011S

Onsemi

FDPC8011S by Onsemi

FDPC8011S by Onsemi is a N-CHANNEL FET for SWITCHING applications. It features 2 ELEMENTS with BUILT-IN DIODE, 60A Max ID, and 0.006 ohm Max RDS(on). Operating in ENHANCEMENT MODE, it has a 25V Min DS Breakdown Voltage and can handle up to 150°C.

Median Price

$2.104

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 314 parts In-Stock

1+ parts

$2.098

100+ parts

$1.809

1k+ parts

$1.755

10k+ parts

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314

$2.098

$1.809

$1.755

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Chip1Stop

Japan . 2,611 parts In-Stock

1+ parts

$2.110

100+ parts

$1.734

1k+ parts

$1.650

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2,611

$2.110

$1.734

$1.650

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Mouser Electronics

USA . 1,885 parts In-Stock

1+ parts

$2.410

100+ parts

$1.400

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1,885

$2.410

$1.400

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DigiKey

USA . 1,732 parts In-Stock

1+ parts

$4.860

100+ parts

$2.274

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$1.968

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1,732

$4.860

$2.274

$1.968

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Rochester

USA . 44,763 parts In-Stock

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-

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$0.874

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$0.725

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$0.647

44,763

-

$0.874

$0.725

$0.647

Verical

USA . 35,561 parts In-Stock

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$0.907

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$0.808

35,561

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$0.907

$0.808

Distributors (In-Stock)

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Bristol Electronics

USA . 2,382 parts In-Stock

1+ parts

$1.697

100+ parts

$0.628

1k+ parts

$0.441

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2,382

$1.697

$0.628

$0.441

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Digiode

USA . 918 parts In-Stock

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$1.700

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918

$1.700

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Nova Conductors

Japan . 44 parts In-Stock

1+ parts

$1.909

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44

$1.909

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Chip Stock

USA . 67,000 parts In-Stock

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Vyrian

USA . 9,036 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,000 parts In-Stock

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ComSIT USA

USA . 3,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,382 parts In-Stock

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Dan-Mar Components

USA . 2,382 parts In-Stock

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Prism Electronics

USA . 999 parts In-Stock

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999

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Semtec, LLC

USA . 87 parts In-Stock

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87

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Inventory MP

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 658 parts In-Stock

1+ parts

$0.620

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658

$0.620

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Ampacity Inc.

Singapore . 9,105 parts In-Stock

1+ parts

$1.360

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9,105

$1.360

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$1.428

100+ parts

$1.299

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$1.171

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50

$1.428

$1.299

$1.171

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Corphita

USA . 1,926 parts In-Stock

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$1.611

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1,926

$1.611

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Netroflash

USA . 100 parts In-Stock

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$1.909

100+ parts

$1.871

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100

$1.909

$1.871

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Microchip USA

USA . 9,316 parts In-Stock

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$11.789

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Perfect Parts

USA . 137,939 parts In-Stock

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 23,652 parts In-Stock

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Kulean Microsystems

USA . 7,183 parts In-Stock

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TANS Electronics

Latvia . 6,446 parts In-Stock

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Problanco Electronics

Mexico . 6,050 parts In-Stock

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SupplyDigital Components

Austria . 4,111 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,994 parts In-Stock

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Supply Digital

USA . 1,206 parts In-Stock

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UHIMA Technologies

Türkiye . 908 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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Overview

Experience the difference with the FDPC8011S by Onsemi, setting a new standard in Small Signal Field Effect Transistors. With a focus on quality and reliability, Onsemi delivers cutting-edge technology for switching applications. This N-channel transistor offers enhanced performance and efficiency, with a maximum drain current of 13A and a minimum DS breakdown voltage of 25V. The compact package design and surface mount capability make it ideal for a wide range of electronic devices. Elevate your projects with the FDPC8011S, where innovation meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good insulation properties and durability, making the transistor suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds, making them suitable for high-frequency applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, offering high speed and efficiency in switching operations.

Minimum DS Breakdown Voltage: 25 V

The minimum breakdown voltage of 25 V ensures reliable operation within specified voltage range, providing protection against voltage spikes.

Maximum Drain Current (Abs) (ID): 60 A

With a high maximum drain current of 60 A, this transistor can handle high current loads without overheating or failing.

Maximum Power Dissipation (Abs): 2 W

The maximum power dissipation of 2 W allows the transistor to handle power efficiently without getting damaged due to overheating.

Maximum Operating Temperature: 150 °C

Can operate reliably at high temperatures up to 150°C, making it suitable for demanding industrial environments.

Maximum Drain-Source On Resistance: 0.006 ohm

Low drain-source on resistance results in minimal power loss and efficient performance in switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) FDPC8011S attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-240BA

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

2 W

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDPC8011S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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