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FDP3652

Onsemi

FDP3652 by Onsemi

FDP3652 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 0.016 ohm Max RDS. Ideal for SWITCHING applications, it features SINGLE configuration with BUILT-IN DIODE. Operating in ENHANCEMENT MODE, it has 9A Max ID and 175°C Max Temp, making it suitable for various power control needs.

Median Price

$2.427

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 200 parts In-Stock

1+ parts

$2.214

100+ parts

$1.069

1k+ parts

$0.827

10k+ parts

$0.761

200

$2.214

$1.069

$0.827

$0.761

DigiKey

USA . 1,323 parts In-Stock

1+ parts

$2.640

100+ parts

$1.166

1k+ parts

$0.887

10k+ parts

$0.767

1,323

$2.640

$1.166

$0.887

$0.767

Mouser Electronics

USA . 1,104 parts In-Stock

1+ parts

$2.640

100+ parts

$1.060

1k+ parts

$0.889

10k+ parts

-

1,104

$2.640

$1.060

$0.889

-

Chip1Stop

Japan . 200 parts In-Stock

1+ parts

$5.540

100+ parts

$1.330

1k+ parts

-

10k+ parts

-

200

$5.540

$1.330

-

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Flip Electronics (Authorized)

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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800

-

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-

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Rochester

USA . 209 parts In-Stock

1+ parts

-

100+ parts

$1.040

1k+ parts

$0.863

10k+ parts

$0.770

209

-

$1.040

$0.863

$0.770

Verical

USA . 196 parts In-Stock

1+ parts

-

100+ parts

$1.079

1k+ parts

$0.834

10k+ parts

$0.768

196

-

$1.079

$0.834

$0.768

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,140 parts In-Stock

1+ parts

$0.810

100+ parts

-

1k+ parts

-

10k+ parts

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1,140

$0.810

-

-

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.067

100+ parts

-

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-

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10

$1.067

-

-

-

TME

Poland . 690 parts In-Stock

1+ parts

$2.440

100+ parts

$1.060

1k+ parts

$1.000

10k+ parts

-

690

$2.440

$1.060

$1.000

-

Flip Electronics

USA . 10,400 parts In-Stock

1+ parts

-

100+ parts

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10,400

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-

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Chip Stock

USA . 3,200 parts In-Stock

1+ parts

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3,200

-

-

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ComSIT Distribution GmbH

Germany . 299 parts In-Stock

1+ parts

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299

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Vyrian

USA . 160 parts In-Stock

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160

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Holdelec - ElecDif-Pro

France . 58 parts In-Stock

1+ parts

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58

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Prism Electronics

USA . 50 parts In-Stock

1+ parts

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50

-

-

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

1+ parts

-

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25

-

-

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Mil-Aero Solutions, Inc.

USA . 22 parts In-Stock

1+ parts

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22

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Sunrise Surplus Inc.

USA . 22 parts In-Stock

1+ parts

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22

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 244 parts In-Stock

1+ parts

$0.680

100+ parts

-

1k+ parts

-

10k+ parts

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244

$0.680

-

-

-

Corphita

USA . 1,082 parts In-Stock

1+ parts

$0.768

100+ parts

-

1k+ parts

-

10k+ parts

-

1,082

$0.768

-

-

-

Corohmni

South Africa . 157 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

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157

$0.800

-

-

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Argo Parts USA

USA . 4,337 parts In-Stock

1+ parts

$1.067

100+ parts

-

1k+ parts

-

10k+ parts

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4,337

$1.067

-

-

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Continental Prestige Electronics

USA . 3,067 parts In-Stock

1+ parts

$1.067

100+ parts

-

1k+ parts

-

10k+ parts

$1.046

3,067

$1.067

-

-

$1.046

Microchip USA

USA . 3,203 parts In-Stock

1+ parts

$12.480

100+ parts

-

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10k+ parts

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3,203

$12.480

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Kepictronics

USA . 64,993 parts In-Stock

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64,993

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RC Electronics

USA . 48,456 parts In-Stock

1+ parts

-

100+ parts

$1.130

1k+ parts

$1.030

10k+ parts

$1.000

48,456

-

$1.130

$1.030

$1.000

Lixinc

USA . 13,770 parts In-Stock

1+ parts

-

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13,770

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Perfect Parts

USA . 8,960 parts In-Stock

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8,960

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TANS Electronics

Latvia . 8,088 parts In-Stock

1+ parts

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8,088

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Problanco Electronics

Mexico . 7,672 parts In-Stock

1+ parts

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7,672

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-

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Kulean Microsystems

USA . 4,740 parts In-Stock

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4,740

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SupplyDigital Components

Austria . 2,895 parts In-Stock

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2,895

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-

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$1.046

1k+ parts

$1.014

10k+ parts

$0.992

2,000

-

$1.046

$1.014

$0.992

Eastek

USA . 1,200 parts In-Stock

1+ parts

-

100+ parts

-

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1,200

-

-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

-

-

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Supply Digital

USA . 964 parts In-Stock

1+ parts

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964

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UHIMA Technologies

Türkiye . 701 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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701

-

-

-

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iodParts Technologies Inc.

India . 350 parts In-Stock

1+ parts

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100+ parts

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350

-

-

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GreenTree Electronics

Israel . 258 parts In-Stock

1+ parts

-

100+ parts

-

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258

-

-

-

-

Overview

Unleash the power of innovation with the FDP3652 by Onsemi, a top-tier manufacturer renowned for cutting-edge technology. As a high-quality Power Field Effect Transistor (FET), this N-CHANNEL device offers unparalleled performance in switching applications. With a robust design and built-in diode, this transistor ensures reliable operation and efficiency. Whether you're in need of enhanced power management or seamless circuit control, the FDP3652 delivers exceptional value and benefits to meet your needs. Elevate your projects to new heights with this versatile and dependable component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and strength, ensuring durability and reliability of the product.

Polarity or Channel Type: N-CHANNEL

N-Channel type makes it suitable for a wide range of applications in switching circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and provides protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient performance in such scenarios.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle high voltages safely.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and integration into circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during installation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers precise control over the switching behavior of the FET.

Avalanche Energy Rating (EAS): 182 mJ

High energy rating ensures the FET can handle transient overloads without damage.

No. of Terminals: 3

Three terminals offer versatile connectivity options for various circuit configurations.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for secure mounting on a heat sink for efficient heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high reliability and performance in a small form factor.

Maximum Operating Temperature: 175 °C

High operating temperature rating ensures stable performance even in demanding environments.

Transistor Element Material: SILICON

Silicon material offers high conductivity and durability for long-lasting performance.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability for reliable connections.

Maximum Drain Current (ID): 9 A

High drain current rating allows the FET to handle large loads with ease.

Maximum Drain-Source On Resistance: 0.016 ohm

Low on-resistance minimizes power loss and improves efficiency in switching applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and circuit design.

Case Connection: DRAIN

Drain connection offers easy interfacing with external components in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) FDP3652 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

182 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP3652 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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