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FDMF5826DC

Onsemi

FDMF5826DC by Onsemi

FDMF5826DC by Onsemi is a MOSFET gate driver with 31 terminals, operating at -40 to 125°C. It features a max supply voltage of 5.5V and nominal output peak current limit of 7A, suitable for automotive applications requiring high side drivers. The package style includes chip carrier and heat sink/slug with a very thin profile, making it ideal for compact designs.

Median Price

$2.230

Lifecycle Status

EOL

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,935 parts In-Stock

1+ parts

$1.538

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2,935

$1.538

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Chip1Stop

Japan . 2,935 parts In-Stock

1+ parts

$2.200

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$2.200

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Rochester

USA . 17,273 parts In-Stock

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$2.230

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$2.000

10k+ parts

$1.880

17,273

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$2.230

$2.000

$1.880

Verical

USA . 12,000 parts In-Stock

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$2.638

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$2.638

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DigiKey

USA . 6,000 parts In-Stock

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$2.580

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6,000

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$2.580

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Distributors (In-Stock)

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Digiode

USA . 2,896 parts In-Stock

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$1.461

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$1.461

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Nova Conductors

Japan . 150 parts In-Stock

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$2.315

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150

$2.315

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DigiKey Marketplace

USA . 17,273 parts In-Stock

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17,273

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Vyrian

USA . 8,129 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 8,044 parts In-Stock

1+ parts

$1.310

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8,044

$1.310

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Corphita

USA . 1,239 parts In-Stock

1+ parts

$1.384

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1,239

$1.384

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Corohmni

South Africa . 92 parts In-Stock

1+ parts

$1.538

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92

$1.538

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Continental Prestige Electronics

USA . 4,600 parts In-Stock

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$2.315

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$2.269

4,600

$2.315

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$2.269

Argo Parts USA

USA . 1,648 parts In-Stock

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$2.315

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1,648

$2.315

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Netroflash

USA . 50 parts In-Stock

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$2.315

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50

$2.315

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Aztec Data Supply Inc.

USA . 2,467 parts In-Stock

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$8.650

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2,467

$8.650

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Perfect Parts

USA . 10,064 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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TANS Electronics

Latvia . 3,149 parts In-Stock

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Kepictronics

USA . 2,986 parts In-Stock

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Kulean Microsystems

USA . 2,354 parts In-Stock

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Microchip USA

USA . 1,903 parts In-Stock

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Supply Digital

USA . 1,516 parts In-Stock

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SupplyDigital Components

Austria . 715 parts In-Stock

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UHIMA Technologies

Türkiye . 267 parts In-Stock

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Problanco Electronics

Mexico . 68 parts In-Stock

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Overview

Elevate your electronic designs with the FDMF5826DC by Onsemi, a top-of-the-line MOSFET gate driver that guarantees quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this chip carrier package boasts a very thin profile and heat sink/slug for efficient performance. Ideal for automotive applications, this high-side driver offers a nominal output peak current limit of 7A and operates between -40°C to 125°C. Say goodbye to technical headaches and hello to seamless integration with the FDMF5826DC – your go-to solution for superior electronic control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good mechanical strength and thermal properties, making the product durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 5.5 V

Supports a maximum supply voltage of 5.5 V, making it suitable for a wide range of applications without risking damage due to high voltage inputs.

Package Shape: SQUARE

Square package shape provides a compact and efficient design, saving space on the PCB and allowing for easier integration into circuit layouts.

No. of Terminals: 31

Having 31 terminals allows for more versatile connectivity and functionality, enabling more complex circuit designs and configurations.

Minimum Supply Voltage: 4.5 V

With a minimum supply voltage of 4.5 V, the product can still operate efficiently in low voltage conditions, ensuring consistent performance.

Maximum Operating Temperature: 125 °C

Capable of operating at temperatures up to 125°C, making it suitable for use in high-temperature environments or applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, the product can withstand cold temperatures, offering reliability in various environmental conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Matte Tin finish provides good solderability and conductivity, ensuring stable connections and performance of the product.

Terminal Position: QUAD

Quad terminal position allows for efficient routing and connection of multiple signals, enhancing the product's functionality and versatility.

Maximum Seated Height: 0.8 mm

Low seated height of 0.8 mm enables a compact and slim design, suitable for space-constrained applications or compact PCB layouts.

Width: 5 mm

Width of 5 mm provides a balance between compactness and functionality, allowing for easy integration into various circuit designs.

High Side Driver: YES

High side driver capability allows for driving of high-side MOSFETs, offering comprehensive control and protection features for power circuits.

Maximum Time At Peak Reflow Temperature (s): 30

Supports a maximum reflow time of 30 seconds at peak temperature, ensuring proper soldering and reliability during PCB assembly processes.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperature of 260°C during soldering processes, ensuring robust mechanical connections.

Length: 5 mm

Length of 5 mm contributes to the compact design of the product, allowing for efficient use of space on the PCB.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliable performance in automotive applications, where temperature fluctuations are common.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and complies with environmental regulations, making it a sustainable choice.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5 V provides a standard operating range, compatible with most electronic systems and applications.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5 mm allows for compact and dense packing of terminals, saving space on the PCB and improving signal integrity.

Nominal Output Peak Current Limit: 7 A

Nominal output peak current limit of 7 A offers sufficient current-handling capability for driving MOSFETs in various power applications.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Half bridge based MOSFET driver interface IC type provides reliable and efficient control of power MOSFETs, enabling precise switching and protection features.

Technical Specifications

MOSFET Gate Drivers FDMF5826DC attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-PQCC-N31

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

31

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Peak Current Limit:

7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC31(UNSPEC)

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

FDMF5826DC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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