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FDMF6704A

Onsemi

FDMF6704A by Onsemi

FDMF6704A by Onsemi is a MOSFET gate driver with 40 terminals, operating voltage range of 3-14V, and peak current limit of 80A. It is designed for military-grade applications, featuring a high side driver and interface IC type as half bridge based MOSFET driver. The package style includes chip carrier and heat sink/slug with very thin profile, suitable for harsh environments.

Median Price

$2.001

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 182,670 parts In-Stock

1+ parts

-

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$1.890

1k+ parts

$1.690

10k+ parts

$1.590

182,670

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$1.890

$1.690

$1.590

DigiKey

USA . 176,670 parts In-Stock

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$2.490

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$2.490

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Verical

USA . 9,000 parts In-Stock

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$2.112

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$1.988

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$2.112

$1.988

Mouser Electronics

USA . 316 parts In-Stock

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$1.750

316

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$1.750

Distributors (In-Stock)

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Vyrian

USA . 3,086 parts In-Stock

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$1.750

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3,086

$1.750

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Digiode

USA . 2,662 parts In-Stock

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$1.995

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$1.995

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DigiKey Marketplace

USA . 10,612 parts In-Stock

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Prism Electronics

USA . 8,212 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 30 parts In-Stock

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30

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Native Components

USA . 979 parts In-Stock

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$0.827

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979

$0.827

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Northwest PG Solutions

USA . 2,292 parts In-Stock

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$0.910

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2,292

$0.910

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Corohmni

South Africa . 264 parts In-Stock

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$1.750

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264

$1.750

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Corphita

USA . 556 parts In-Stock

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$1.890

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Metaverse IC Inc.

Canada . 283,600 parts In-Stock

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Perfect Parts

USA . 28,522 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 18,649 parts In-Stock

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Continental Prestige Electronics

USA . 10,612 parts In-Stock

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$1.520

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SupplyDigital Components

Austria . 5,994 parts In-Stock

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TANS Electronics

Latvia . 5,869 parts In-Stock

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Problanco Electronics

Mexico . 5,527 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Microchip USA

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Assy Fe

Spain . 2,500 parts In-Stock

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Kepictronics

USA . 1,569 parts In-Stock

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Supply Digital

USA . 1,292 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 509 parts In-Stock

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Overview

Discover the power and reliability of the FDMF6704A MOSFET Gate Driver by Onsemi. With a maximum supply voltage of 14V and a wide operating temperature range, this premium quality chip carrier is designed for military-grade applications. Its innovative design ensures optimal performance and durability, making it a top choice for demanding projects. Trust Onsemi's expertise in semiconductor technology to deliver cutting-edge solutions that exceed expectations. Elevate your designs with the FDMF6704A and experience unparalleled value and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 14 V

Can handle higher supply voltages which makes it suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape allows for efficient layout on circuit boards and ease of integration.

No. of Terminals: 40

Provides a high level of connectivity options for interfacing with other components in a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style allows for efficient heat dissipation and compact design.

Minimum Supply Voltage: 3 V

Can operate at lower supply voltages, making it versatile for various power supply configurations.

Maximum Operating Temperature: 150 °C

Ability to operate at high temperatures ensures reliability in harsh environments.

Minimum Operating Temperature: -55 °C

Can withstand low temperatures, enabling operation in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connections with other components.

Maximum Seated Height: 0.8 mm

Low profile design minimizes space requirements and enhances overall system integration.

Width: 6 mm

Compact width allows for efficient use of space on a circuit board.

High Side Driver: YES

Includes high side driver functionality for controlling power to connected devices or components.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand reflow soldering process without compromising performance.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing processes.

Length: 6 mm

Compact length allows for efficient use of space on a circuit board.

Temperature Grade: MILITARY

Military-grade quality ensures durability and reliability in demanding conditions.

Terminal Form: NO LEAD

Lead-free terminal form is environmentally friendly and compliant with regulations.

Nominal Supply Voltage: 12 V

Nominal supply voltage is suitable for many standard power supply configurations.

Terminal Pitch: 0.5 mm

Small terminal pitch allows for high density connections on a circuit board.

Nominal Output Peak Current Limit: 80 A

High output peak current limit allows for driving power-hungry loads with ease.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Incorporates a half-bridge based MOSFET driver interface for efficient power delivery and control.

Technical Specifications

MOSFET Gate Drivers FDMF6704A attributes and parameters. Explore more MOSFET Gate Drivers devices from Onsemi

Specs

High Side Driver:

YES

Interface IC Type:

JESD-30 Code:

S-XQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Nominal Output Peak Current Limit:

80 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

14 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

FDMF6704A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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