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FDMF5821

Onsemi

FDMF5821 by Onsemi

FDMF5821 by Onsemi is a 33-terminal switching regulator with a max output current of 60A and a control technique of pulse width modulation. It operates in automotive-grade temperatures, with a wide input voltage range of 4.5V to 5.5V, making it ideal for automotive applications requiring high power efficiency and precise current control at up to 1500kHz switching frequency.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,496 parts In-Stock

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Digiode

USA . 2,151 parts In-Stock

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Native Components

USA . 277 parts In-Stock

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$12.591

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Northwest PG Solutions

USA . 2,209 parts In-Stock

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$12.465

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AZTECH Wire

Italy . 1,187 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,921 parts In-Stock

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Kulean Microsystems

USA . 7,288 parts In-Stock

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Problanco Electronics

Mexico . 5,945 parts In-Stock

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SupplyDigital Components

Austria . 3,101 parts In-Stock

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TANS Electronics

Latvia . 2,430 parts In-Stock

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Microchip USA

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Corphita

USA . 1,810 parts In-Stock

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UHIMA Technologies

Türkiye . 792 parts In-Stock

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Corohmni

South Africa . 221 parts In-Stock

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Overview

The FDMF5821 by Onsemi is a top-of-the-line switching regulator and controller that offers unparalleled quality and reliability. Designed for automotive applications, this product boasts a wide operating temperature range from -40 °C to 125°C, making it ideal for challenging environments. With a maximum output current of 60A and a control mode of current-mode, the FDMF5821 ensures efficient power management and optimal performance. Trust in Onsemi's expertise in semiconductor manufacturing to deliver a superior product that meets all your needs for power regulation. Experience the value and benefits of the FDMF5821 today!

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on the surface of a PCB, making it convenient for assembly and reducing overall product size.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, maximizing component density.

No. of Terminals: 33

The high number of terminals provide flexibility for connecting to other components in the circuit.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can perform reliably in various environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control provides stable and efficient regulation of the output voltage, ensuring consistent performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in cold environments without sacrificing performance.

Maximum Output Current: 60 A

With a high maximum output current, this product is suitable for applications that require high power output.

Control Technique: PULSE WIDTH MODULATION

PWM control technique allows for precise regulation of the output voltage, improving efficiency and performance.

Switcher Config: BUCK

The buck switcher configuration efficiently steps down the input voltage, making it ideal for applications where lower output voltage is required.

Technical Specifications

Switching Regulators & Controllers FDMF5821 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Additional Features:

ALSO AVAILABLE WITH 4.5 TO 16 V INPUT; AVAILABLE IN PFM MODE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

4.5 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-XBCC-N33

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

33

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

60 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1500 kHz

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

FDMF5821 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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