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FDMF3030

Onsemi

FDMF3030 by Onsemi

FDMF3030 by Onsemi is a voltage-mode switching regulator with 40 terminals in a square chip carrier package. It operates b/w -40 to 125 °C, making it suitable for automotive applications. With a max switching frequency of 1000 kHz, it offers efficient power control in compact designs.

Median Price

$3.265

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,000 parts In-Stock

1+ parts

$1.920

100+ parts

$1.800

1k+ parts

$1.630

10k+ parts

-

12,000

$1.920

$1.800

$1.630

-

DigiKey

USA . 2,767 parts In-Stock

1+ parts

$4.610

100+ parts

$2.163

1k+ parts

$1.663

10k+ parts

-

2,767

$4.610

$2.163

$1.663

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,104 parts In-Stock

1+ parts

$1.824

100+ parts

-

1k+ parts

-

10k+ parts

-

1,104

$1.824

-

-

-

Vyrian

USA . 1,407 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

-

10k+ parts

-

1,407

$1.920

-

-

-

Flip Electronics

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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18,000

-

-

-

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Cyclops Electronics Ltd

UK . 120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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120

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,542 parts In-Stock

1+ parts

$1.728

100+ parts

-

1k+ parts

-

10k+ parts

-

1,542

$1.728

-

-

-

Corohmni

South Africa . 367 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

-

10k+ parts

-

367

$1.920

-

-

-

Microchip USA

USA . 2,149 parts In-Stock

1+ parts

$12.044

100+ parts

-

1k+ parts

-

10k+ parts

-

2,149

$12.044

-

-

-

Native Components

USA . 607 parts In-Stock

1+ parts

$33.792

100+ parts

-

1k+ parts

-

10k+ parts

$32.441

607

$33.792

-

-

$32.441

Northwest PG Solutions

USA . 2,075 parts In-Stock

1+ parts

$37.172

100+ parts

-

1k+ parts

-

10k+ parts

-

2,075

$37.172

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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27,673

-

-

-

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Kepictronics

USA . 21,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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21,000

-

-

-

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Perfect Parts

USA . 11,043 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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11,043

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-

-

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TANS Electronics

Latvia . 6,423 parts In-Stock

1+ parts

-

100+ parts

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6,423

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-

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Kulean Microsystems

USA . 6,250 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,250

-

-

-

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SupplyDigital Components

Austria . 6,096 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,096

-

-

-

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Problanco Electronics

Mexico . 5,367 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,367

-

-

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Metaverse IC Inc.

Canada . 2,890 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,890

-

-

-

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GreenTree Electronics

Israel . 2,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,490

-

-

-

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Authorized Procurement Solutions

USA . 2,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,390

-

-

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A-Z Elektronik GmbH

Germany . 2,111 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,111

-

-

-

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UHIMA Technologies

Türkiye . 943 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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943

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-

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Supply Digital

USA . 316 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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316

-

-

-

-

Overview

Experience superior quality and performance with the FDMF3030 by Onsemi. As a leading manufacturer in the industry of Switching Regulators & Controllers, Onsemi ensures top-notch reliability and cutting-edge technology in their products. The FDMF3030 is perfect for a wide range of applications, offering customers unparalleled value and benefits. With its advanced features and high efficiency, this product delivers exceptional results while maintaining an affordable price point. Upgrade your systems today with the FDMF3030 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy packaging provides durability and protection for the internal components, making this product suitable for rugged environments.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square package shape is space-efficient and allows for efficient use of PCB real estate, making it ideal for compact electronic devices.

No. of Terminals: 40

Having 40 terminals provides sufficient connectivity options for various input and output configurations, enhancing the flexibility of the product.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers excellent thermal performance and signal integrity, ensuring reliable operation under varying conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to withstand demanding operating conditions without compromising performance or longevity.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides precise regulation of output voltage, resulting in stable and efficient power delivery for connected devices.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can function reliably in cold environments, making it suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish offers good solderability and corrosion resistance, contributing to the overall reliability and longevity of the product.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection to the circuit board, simplifying the installation process and reducing the risk of disconnection.

Other IC type: SWITCHING REGULATOR

Switching regulator IC type ensures high efficiency and low power dissipation, making the product energy-efficient and suitable for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature minimizes the risk of thermal damage during soldering, ensuring the product's reliability and performance.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables the product to withstand the soldering process effectively, resulting in robust and reliable solder joints.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification ensures the product can operate reliably in automotive applications, where temperature fluctuations are common.

Maximum Switching Frequency: 1000 kHz

High maximum switching frequency allows for fast and efficient power conversion, reducing noise and improving the overall performance of the product.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with RoHS regulations, making the product a sustainable choice for electronic applications.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5mm enables compact design and high-density mounting, making the product suitable for space-constrained applications.

Technical Specifications

Switching Regulators & Controllers FDMF3030 attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Maximum Switching Frequency:

1000 kHz

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FDMF3030 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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